Full Automatic FOG/FOF Bonder OL-FB2000A, Full Automatic FOG/FOF Bonding machine.
Full Automatic COG/COF BonderFOG FOF bonding machine
1. Equipment and Company Information
Equipment Name: Full – automatic FOG/FOF Bonder
Equipment Model: OL-FB2000A
Application: Suitable for 1″-7″ LCD products, meeting the requirements of single – edge single FPC automatic ACF application, alignment, and thermal compression.
Compatibility: Can be used in conjunction with other devices from the same company.
2. Working Principle
The process involves several key steps:
ACF Application: Anisotropic Conductive Film (ACF) is precisely applied to the glass substrate.
Tape Attachment: A tape is attached to the FPC to facilitate handling and alignment.
Precision Alignment: Advanced vision systems are used to align the FPC with the glass substrate at a high – precision level.
Bonding Process: Heat and pressure are applied to activate the ACF, forming a stable connection.
3. Product Specifications
LCD Specifications: Size ranges from L 20mm * W 20mm to L 230mm * W 120mm, thickness between 0.15mm and 1.1mm.
FPC Specifications: Size from L 20mm * W 10mm to L 150mm * W 122mm, thickness between 0.1mm and 0.5mm.
ACF Specifications: Available in reel – to – reel, 2 – layer or 3 – layer types, with specific application dimensions and material properties.
4. Machine Performance
Production Accuracy: High – precision alignment and bonding with specified tolerances for ACF application and FPC bonding.
Production Beat: Efficient production rates with specified time limits for each process step.
5. Process Parameters
Temperature Control: Wide temperature range for different bonding stages, with precise control methods.
Time Setting: Adjustable time ranges for each bonding stage.
Pressure Control: Variable pressure ranges for ACF application, pre-bonding, and main bonding.
6. Overall Machine Specifications
Dimensions: Machine length around 2600mm, width around 1150mm, height around 2000mm.
Weight: Approximately 2000KG.
Color: White, with customization options.
Operating Environment: Requires a cleanroom environment of 1000 – class or below.
Power Supply: Single – phase 220VAC with specific power requirements.
Pneumatic and Vacuum Requirements: Detailed specifications for air pressure, consumption, and vacuum levels.
7. Unit Specifications
Detailed specifications for each unit involved in the bonding process, including material handling, alignment, bonding, and quality control.
8. Control System
Control Method: PLC control with a touch screen interface for easy operation and parameter adjustment.
Safety Features: Emergency stop buttons, interlock design, and alarm systems for safe operation.
9. Documentation and After – sales Service
Comprehensive documentation and training provided, along with after – sales service details.
10. Main Components
Information on the brands and origins of key components used in the machine, ensuring quality and reliability.
This Full – automatic FOG/FOF Bonder is designed for high – precision and efficient bonding processes in the electronics manufacturing industry, particularly for LCD products. It integrates multiple processes into a single machine, offering customizable solutions to meet specific production needs.
