This equipment is a small-sized fully automatic COG (Chip On Glass) bonder, compatible with COF bonding. It realizes the entire process from ACF (Anisotropic Conductive Film) attachment, IC pre-pressing, to IC main pressing. The LCD adopts visual alignment, and the mechanical arm uses a linear motor design for automatic feeding and unloading of LCDs. The machine features a single-sided single-IC bonding process.
1. Technical Parameters
1.1 Glass Specifications
Glass Size Range: 1 inch to 7 inches (16:9 aspect ratio)
Glass Thickness Range: Minimum 0.2 mm, Maximum 1.1 mm
1.2 Alignment Method
Alignment Method: Visual alignment
Image Processing System: Beijing Boshi
1.3 IC Specifications
IC Size: Minimum 5.0 x 0.8 mm, Maximum 35 x 4 mm
IC Bonding Quantity: Single IC
Process Cycle: 3.5 seconds
1.4 Bonding Precision
Attachment Precision: X ± 0.15 mm, Y ± 0.1 mm
Overall Bonding Precision: ± 5 μm
1.5 Press Heads
Press Head Quantity: 1 attachment head + 1 pre-press head + 4 main press heads
ACF Press Head: SUS 440C, 4.0 x 60 mm, 1 pneumatic cylinder
IC Pre-Press Head: SUS 440C, 3 x 30 mm, 1 servo + pneumatic cylinder
Main Press Head: Ceramic/tungsten steel, 5.0 x 40 mm, 4 heads
Main Press Method: Vacuum + pneumatic cylinder
1.6 ACF Specifications
ACF Width: 1 to 5 mm
ACF Length: 1 to 40 mm
1.7 Mark Distance
Mark Distance: Minimum 5.0 mm, Maximum 60 mm
1.8 Pre-Alignment Method
Pre-Alignment Method: Visual alignment
ACF Detection: Visual detection
1.9 Power Supply
Working Power Supply / Power: 220V (±10%) / 50 Hz / 12.5 kW
1.10 Air Supply
Main Air Supply / Air Consumption: 0.5 to 0.7 MPa / 300 L/min
1.11 Device Dimensions and Weight
Device Dimensions: 2800 mm (L) × 1350 mm (W) × 1800 mm (H) (excluding FFU)
Device Weight: ≈ 3000 kg
2. Product Introduction
The Automatic Small-Sized COG (COF) Bonder Machine is a sophisticated piece of equipment designed for the bonding process in LCD manufacturing. It supports the entire process from ACF attachment to IC pre-pressing and main pressing, ensuring high precision and efficiency.
Key Features:
High Precision: The machine achieves an attachment precision of X ± 0.15 mm and Y ± 0.1 mm, with an overall bonding precision of ± 5 μm.
Versatility: It supports glass sizes ranging from 1 inch to 7 inches and IC sizes from 5.0 x 0.8 mm to 35 x 4 mm.
Advanced Technology: The machine uses visual alignment and a linear motor design for the mechanical arm, ensuring accurate and reliable bonding.
Efficient Process: The process cycle is 3.5 seconds, making it highly efficient for high-volume production.
Durable Construction: Built with high-quality materials and components, the machine ensures long-term reliability and performance.
Applications:
Ideal for LCD manufacturing facilities requiring high-precision and efficient bonding processes. The machine is suitable for both COG and COF bonding, providing a comprehensive solution for LCD assembly.
After-Sales Support:
Training: Comprehensive training on equipment installation, operation, maintenance, and troubleshooting.
Service: One year of free service (excluding human damage) and lifelong technical support.
The Automatic Small-Sized COG (COF) Bonder Machine is a cost-effective and efficient solution for modern LCD production, offering advanced technology and reliable performance.
