OL-F006 – 7-Inch Dual-Station Manual FOG Bonding Machine with Dual-Lens Upper-Lower Alignment
The OL-F006 by Olian Automatic is a high-precision manual FOG (Fpc-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. Featuring dual independent workstations, this system enables efficient, repeatable bonding for small-batch production, pilot lines, and display repair applications.
Unlike standard bonders, the OL-F006 integrates simultaneous upper-lower optical alignment with front-rear platform motion, allowing operators to achieve micron-level accuracy through direct visual matching of panel and FPC fiducial marks—without automated vision software.
This machine performs final main bonding only. It assumes that anisotropic conductive film (ACF) has already been pre-laminated onto either the glass panel or the FPC. The OL-F006 does not apply ACF, nor does it support IC or COF bonding. Its sole purpose is the thermal curing of pre-aligned FPC-to-glass or touch-flex-to-glass assemblies.
The OL-F006 features two identical, fully independent bonding stations arranged side by side. Each station includes its own:
Operators can work on both stations alternately to maximize throughput, or two technicians can operate simultaneously. All loading, unloading, and alignment are performed manually at the front of the machine.
The heart of the OL-F006 is its dual optical path alignment system. Two high-resolution lenses—one viewing the panel from below, the other viewing the FPC from above—project real-time images onto a single split-screen monitor. This allows the operator to see both sets of alignment marks simultaneously.
Key optical specs:
The operator places the panel on the lower glass stage and activates vacuum hold. They then position the FPC on the upper stage. Using manual X-Y adjustment knobs beneath the panel stage, they shift the glass until the panel marks align perfectly with the FPC marks on screen. This “upper-lower” visual method ensures high alignment fidelity without complex software calibration.
Once alignment is confirmed:
This front-rear motion keeps the operator’s hands safely away from the hot zone during pressing while maintaining ergonomic access during setup.
Heating is achieved via embedded cartridge heaters, with temperature monitored by industrial-grade sensors to ensure process stability.
The machine includes an integrated buffer tape feeding system to protect the FPC during bonding:
All critical parameters—temperature, time, pressure—are set and monitored via the HMI, ensuring consistent results across shifts and operators.
The compact footprint fits easily into most cleanroom or workshop environments.
Ideal for bonding:
Commonly used in:
Olian Automatic provides comprehensive post-sale support:
Model: OL-F006
Type: Dual-Station Manual FOG Main Bonding Machine
Max Panel Size: 7 inches (rigid glass)
Core Innovation: Upper-lower dual-lens visual alignment + front-rear platform motion
Operation: Manual alignment, semi-automatic bonding cycle
SEO Keywords:
Dual-station FOG bonding machine, OL-F006, Olian Automatic manual FPC bonder, 7-inch Film-on-Glass press with dual-lens alignment, upper-lower mark alignment system, front-rear motion FOG machine, manual FPC to glass bonding equipment, thermal compression bonder for touch flex, high-precision manual FOG workstation, split-screen vision FOG press.
OL-C012C – 7-Inch Dual-Station Servo Main Bonding Machine with CCD Alignment
The OL-C012C by Olian Automatic is a dual-station manual main bonding machine with CCD vision alignment. It performs final thermal compression bonding of bare ICs onto rigid LCD panels up to 7 inches.
This system assumes that ACF has already been applied to the panel. The operator places the IC roughly by hand. The built-in CCD system then enables fine visual alignment before main bonding.
The operator loads an ACF-pre-laminated panel onto either station.
They place the IC near the terminal area by hand.
Using the CCD display, they adjust the IC position visually for alignment.
After alignment, they press both start buttons with two hands.
The servo-driven hot bar descends automatically.
It applies heat, pressure, and time to complete the main bond.
The head retracts after cooling. The operator removes the panel.
Both stations can be used alternately by one operator or simultaneously by two.
Bonding temperature: up to 300°C
Temperature uniformity: within ±5°C
Bonding time: 0.1 to 99.0 seconds, adjustable
Pressure range: 20 N to 400 N, servo-regulated
Standard hot bar size: 40 mm × 4.0 mm (custom sizes available)
Heating elements: Φ9.5 × 70 mm cartridge heaters
Temperature sensing: K-type thermocouples
Control system: PLC + touchscreen interface
Manual backup: physical start and emergency stop buttons
Safety: dual-hand start prevents accidental activation
Dimensions: 920 mm (W) × 900 mm (D) × 1590 mm (H)
Weight: approx. 430 kg
Power: single-phase 220V AC, 2000W
Compressed air: 0.5–0.7 MPa, flow 450 L/min, Φ8 mm tubing
Designed exclusively for main bonding of bare driver ICs on:
This machine does not perform:
Its role is final IC/COF/FPC curing with visual alignment aid.
Model: OL-C012C
Type: Dual-Station Main Bonding Machine with CCD
Function: Final IC Thermal Bonding with Visual Alignment
Max Panel Size: 7 inches (rigid glass only)
Core Advantage: Combines manual flexibility with CCD-assisted precision
SEO Keywords:
CCD main bonding machine, OL-C012C, Olian Automatic IC bonder with vision, 7-inch dual-station hot bar press, servo main bonder with CCD alignment, COG final bonding equipment, thermal compression machine for LCD IC, manual IC aligner with camera, rigid display main bonding system, hot bar bonder with visual alignment.
OL-C012 – 7-Inch Dual-Station Servo Main Bonding Machine
The OL-C012 by Olian Automatic is a dual-station manual main bonding machine. It performs final thermal compression bonding of ICs/COF/FPC onto rigid LCD panels up to 7 inches.
This system assumes that ACF has already been applied and ICs have been pre-aligned on the panel. The machine executes only the main bonding (final curing) step.
The operator places an ACF-pre-laminated LCD with pre-positioned IC onto either station.
They press a vacuum button to secure the panel.
Then they press both start buttons with two hands.
The servo-driven bonding head descends smoothly.
It applies precise heat, pressure, and time to fully cure the bond.
After cooling, the head retracts automatically.
The operator removes the bonded panel manually.
Both left and right stations operate independently. Two operators can work simultaneously, or one operator can alternate between stations.
Bonding head temperature: up to 300°C
Temperature uniformity: within ±5°C
Bonding time: adjustable from 0.1 to 99.0 seconds
Pressure range: 20 N to 400 N, controlled by servo motor
Standard head size: 40 mm × 4.0 mm (custom sizes available)
Heating uses high-efficiency Φ9.5×70 mm, 220V, 220W cartridge heaters.
Temperature is monitored by K-type thermocouples.
Machine frame: industrial-grade steel
Control system: servo motor + PLC logic
Safety features: dual-hand start buttons, emergency stop switch
All manual operations occur at the same front position for ergonomic workflow
Dimensions: 920 mm (W) × 900 mm (D) × 1590 mm (H)
Weight: approximately 430 kg
Power: single-phase 220V AC, 2000W
Compressed air: 0.5–0.7 MPa, flow 450 L/min, tubing Φ8 mm
Designed exclusively for main bonding of bare ICs on:
Not suitable for pre-bonding.
This machine does not include:
It is a dedicated main bonder for final IC curing only.
Includes one-year warranty (excluding wear parts like heating tubes).
On-site service within 72 hours if phone support fails during warranty.
One day of training covers installation, operation, parameter setup, and maintenance.
Lifetime remote technical support is provided.
Model: OL-C012
Type: Dual-Station Manual Main Bonding Machine
Function: Final IC Thermal Compression Only
Substrate: Rigid Glass Panels (≤7 inches)
Core Tech: Servo-controlled pressure, precise thermal management
SEO Keywords:
Servo main bonding machine, OL-C012, Olian Automatic IC bonder, 7-inch dual-station hot bar press, manual main bonding for COG, thermal compression machine for LCD IC, final curing bonder for rigid displays, servo-controlled hot bar system, IC main bonding equipment, COG main bonder without vision.
The OL-Q006 by Olian Automatic is a manual cleaning machine for LCD panel terminals. It prepares ITO bonding areas by removing contaminants before thermal bonding.
This unit combines lint-free cloth wiping and plasma cleaning to ensure high surface cleanliness. It is designed for panels with pre-applied anisotropic conductive film (ACF).
Suitable for rigid and flexible displays:
Panel size range:
The operator loads and unloads panels manually.
They initiate the cleaning cycle using control buttons.
No automatic alignment or robotic handling is included.
Worktable size: 170 mm (W) × 190 mm (D)
Lint-free roll: inner diameter >25 mm, outer diameter <200 mm
Vacuum system: yellow tubing, flow ≈36 L/min
Compressed air: 0.4–0.7 MPa, transparent Φ8 mm tubing, flow ≈120 L/min
Power supply: single-phase AC 220V, 50/60 Hz, 1500 W
Machine dimensions: 680 mm (W) × 850 mm (D) × 1350 mm (H)
Work height: 800 ± 30 mm
Net weight: ~161 kg
Frame color: beige
Other parts: chrome-plated or anodized
Core components:
Must be used in a cleanroom:
All hazardous zones are labeled with warning signs.
The machine is delivered clean and ready for installation.
This is a pre-bonding cleaning station only.
It does not perform:
Its sole purpose is terminal surface preparation.
Includes one-year warranty (excluding wear parts).
On-site service within 72 hours if remote support fails.
One-day training covers operation and basic maintenance.
Lifetime technical support is provided.
Model: OL-Q006
Function: LCD Terminal Cleaning Only
Methods: Lint-Free Wiping + Plasma Treatment
Operation: Fully Manual
Max Panel Size: 7 inches
SEO Keywords:
LCD terminal cleaner, OL-Q006, Olian Automatic plasma cleaning machine, manual ITO cleaning station, pre-bonding surface prep, lint-free wipe and plasma system, 7-inch display cleaning equipment, ACF-ready terminal cleaner, LCD panel pre-treatment machine, manual LCD cleaning workstation.
OL-FD006 – 7-Inch Single-Station Manual FOG Bonding Machine with Dual-Lens up and down Alignment
The OL-FD006 by Olian Automatic is a single-station manual FOG (Film-on-Glass) bonding machine. It bonds flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches.
This system is designed for high-precision alignment and thermal bonding. It assumes ACF has been pre-applied to the panel or FPC. The machine does not support COF (Chip-on-Flex) bonding.
The unit uses a dual-lens optical system. Operators view panel and FPC marks simultaneously on one screen.
Magnification is 2×. Field of view per lens is 1.9 mm × 1.4 mm.
Lens spacing adjusts from 12 mm to 90 mm to match different mark layouts.
Coaxial LED lighting ensures clear, shadow-free imaging.
Operators manually adjust the panel’s X and Y position using knobs for precise alignment.
The operator places the panel on the lower stage and activates vacuum hold.
They then place the FPC on the upper stage.
After visual alignment via the display, they press both start buttons with two hands.
The bonding head descends automatically. It applies heat, pressure, and holds for a set time.
Temperature reaches up to 300°C with uniformity within ±5°C.
Pressure ranges from 25 N to 400 N. Time is adjustable from 0.1 to 99.0 seconds.
After bonding, the head retracts. The stage returns to load position. The operator removes the product.
The machine includes an automatic buffer tape feed system.
Tape roll inner diameter: ≥33 mm. Outer diameter: ≤80 mm.
Feed pitch: 1–20 mm.
If feeding fails, the system triggers an alarm.
One operator handles all loading and unloading at the same position.
The machine features a PLC controller and color touchscreen.
Standard bonding head size is 60 mm × 1.0 mm, but custom sizes are available.
Machine dimensions: 830 mm (W) × 900 mm (D) × 1340 mm (H). Weight: ~320 kg.
Power: 220V AC, 2000W. Air: 0.5–0.7 MPa, 250 L/min.
Ideal for bonding:
Not suitable for bare ICs or standard COF modules.
Includes one-year warranty (excluding wear parts).
On-site service within 72 hours if phone support fails.
One-day training covers operation, alignment, parameter setup, and maintenance.
Lifetime remote technical support is provided.
Model: OL-FD006
Function: FPC and Touch Flex Bonding Only
Excludes: COF, IC, ACF lamination, EC cleaning
Key Feature: Dual-lens split-screen manual alignment
SEO Keywords:
Manual FOG bonding machine, OL-FD006, Olian Automatic FPC bonder, 7-inch Film-on-Glass press, dual-lens alignment system, FPC to LCD bonding equipment, thermal compression for touch flex, manual X-Y alignment bonder, FPC bonding for rigid displays, split-screen vision FOG machine.
The OL-FPD005 by Olian Automatic is a single-station manual pulse pre-bonding machine. It is designed for COF (Chip-on-Flex) alignment and thermal pre-compression on panels up to 7 inches. The system supports both rigid glass and flexible displays.
This machine requires operators to perform all loading, alignment, and bonding steps manually. It provides precise thermal and pressure control during pre-bonding but does not include vision alignment or automatic motion.
The operator places the panel on the worktable. They press a vacuum button to secure it.
Next, they position the COF on the COF stage and align it roughly with the panel terminals. Vacuum holds the COF in place.
The operator then uses the display screen to fine-tune alignment visually.
After confirming alignment, they press the pre-bond button once—the left press head descends without heating to check contact.
Pressing the same button again lifts the head.
If alignment is acceptable, the operator presses two start buttons simultaneously with both hands. The head then lowers automatically, applies heat, and performs pulse pre-bonding.
When the set time ends, the system blows air to cool the bond area. The head retracts. The cycle is complete.
Finally, the operator removes the bonded panel manually.
All steps are manual except the controlled descent, heating, timing, cooling, and lift during the final bonding phase.
The left press head heats from room temperature to 400°C using pulse heating. Surface temperature uniformity is within ±8°C.
Heating time is adjustable from 0.1 to 99.9 seconds.
Bonding force ranges from 20 N to 300 N.
The standard press head size is 50 mm long × 0.8 mm thick, but custom sizes are available.
Only one operator is needed. All loading and unloading happen at the same position.
The machine includes a display screen for visual alignment reference.
It uses industrial-standard controls: Φ24 vacuum and start buttons, and a Φ22 emergency stop switch.
Core components include a 9.5 mm × 70 mm heating tube, a K-type thermocouple, and a custom hot press head.
Ideal for:
Note: This machine does not apply ACF, does not bond ICs, and has no automated vision system. ACF must be pre-laminated before use.
Olian Automatic offers a one-year warranty on parts and labor (excluding wear items).
On-site service is provided within 72 hours if remote support fails during warranty.
One day of training covers installation, operation, parameter setup, troubleshooting, and consumable replacement.
Lifetime technical support is available.
Model: OL-FPD005
Type: Manual Pulse Pre-Bonding Machine
Function: COF Pre-Bonding Only
Panel Size: Up to 7 inches
Substrates: Glass or Flexible Panels
Operation: Fully manual alignment; semi-automated thermal bonding
SEO Keywords:
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The OL-COF003 by Olian Automatic is a medium-speed semi-automatic pre-bonding machine. It bonds ICs or COFs onto ACF-pre-applied panels. The system supports both rigid glass and flexible displays up to 7 inches.
This machine is designed for high-precision alignment and thermal pre-compression. Operators load and unload panels manually. All other steps—IC/COF pickup, vision alignment, and pre-bonding—are automated.
The OL-COF003 handles two main workflows: IC pre-bonding and COF pre-bonding.
For IC bonding, the operator loads IC trays (2-inch, 3-inch, or 4-inch). The machine uses a servo motor, lead screw, and linear guide to move the IC stage. A vacuum nozzle picks up the IC. A dedicated jig corrects IC position from both sides. The head then moves down for CCD imaging of IC marks. After vision alignment with the panel mark, the machine performs pre-bonding automatically.
For COF bonding, the operator places COF on a PEEK adsorption platform. The COF stage is driven by a cylinder for left-right motion. Vacuum holds the COF in place. A quartz back-pressure unit ensures flatness during pickup. The bonding head adsorbs the COF, retracts the stage, and moves down for CCD imaging. The system then aligns the COF with the panel and completes pre-bonding.
Panel loading is manual. The operator places the panel on the stage and presses a vacuum button. The stage then moves automatically to the alignment position. After bonding, it returns to the loading position for easy removal.
Temperature control ranges from room temperature to 150°C. Surface uniformity stays within ±5°C.
Bonding time is adjustable from 0.1 to 99.0 seconds.
Pressure is precisely controlled between 20 N and 120 N.
The machine uses industrial-grade components for reliability. It includes safety interlocks and user-friendly controls.
The unit measures 650 mm wide, 660 mm deep, and 1340 mm tall. It weighs about 230 kg.
It runs on single-phase 220V AC at 1500W.
Compressed air must be 0.5–0.7 MPa with a flow rate of 450 L/min, using 8 mm tubing.
Ideal for small-batch production, pilot lines, and R&D.
Supports:
Note: ACF must be pre-applied before use. This machine does not apply ACF.
Olian Automatic provides one year of warranty (excluding wear parts).
On-site service is available within 72 hours if phone support fails.
One day of training covers setup, operation, troubleshooting, and part replacement.
Lifetime technical support is included.
Model: OL-COF003
Type: Semi-Automatic Pre-Bonding Machine
Max Panel Size: 7 inches
Processes: IC Pre-Bonding, COF Pre-Bonding
Substrates: Rigid Glass, Flexible Displays
Operation: Manual panel load/unload; automatic alignment and bonding
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The OL-CBS003 by Olian Automatic is a purpose-built manual thermal bonding system designed exclusively for Chip-on-Glass (COG) assembly of rigid LCD panels up to 7 inches.
This dual-station machine integrates two critical stages of the COG process—pre-bonding and main bonding—into a single, space-efficient platform, enabling reliable attachment of bare driver ICs to glass substrates that have already been pre-laminated with anisotropic conductive film (ACF).
The OL-CBS003 assumes ACF has been applied in a prior step using a separate laminating machine. It does not perform ACF application, electrode cleaning (EC), FPC handling, or FOG bonding.
Instead, it focuses solely on precision thermal compression to ensure high-yield IC-to-glass interconnection—making it ideal for repair centers, R&D labs, pilot lines, and low-volume display production.
The machine features two independent workstations arranged side by side:
Both stations operate independently, allowing one operator to manage the entire sequence efficiently while minimizing cross-contamination and handling errors.
The OL-CBS003 is widely used in environments where precision, simplicity, and cost-effectiveness are paramount:
Olian Automatic provides comprehensive support to ensure long-term productivity:
For teams working with rigid LCD modules that require dependable COG bonding, the OL-CBS003 delivers a focused, no-frills solution. By separating pre-bonding and main bonding into dedicated stations—and eliminating unnecessary functions like ACF feeding or cleaning—it offers unmatched clarity of purpose, ease of use, and process control.
Developed by Olian Automatic, a certified national high-tech enterprise specializing in display assembly equipment. the OL-CBS003 represents a smart investment for any operation prioritizing quality, reliability, and operational simplicity in COG manufacturing.
Model: OL-CBS003
Type: Manual Dual-Station Pre-Bonding and Main Bonding Machine
Max Panel Size: 7 inches (rigid glass only)
Core Process: COG bonding of bare ICs to ACF-pre-applied LCDs
Excluded Functions: ACF lamination, electrode cleaning. FPC/FOG bonding, flexible substrate support
SEO Keywords:
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OL-A003D 7-Inch Single-Edge Single-Stage ACF Laminating Machine – Compact, Manual Thermal Bonding System for Precision Display Assembly.
The OL-A003D by Olian Automation is a compact, semi-automatic ACF (Anisotropic Conductive Film) laminating machine designed for high-precision bonding of ACF onto LCD panels, flexible printed circuits (FPCs), or rigid PCBs. Optimized for small-format displays up to 7 inches, this manual ACF bonding machine features a 150 mm heated press head and supports both rigid glass substrates and flexible display modules, making it ideal for R&D labs, pilot lines, repair centers, and low-volume production environments.
Unlike complex automated systems, the OL-A003D simplifies the ACF bonding process: operators manually load and unload the panel, while the machine automatically executes the thermal compression cycle, ACF feeding, peeling, and cutting—ensuring consistent, repeatable results with minimal training.
The OL-A003D is widely used in:
Built with robust mechanical design and standard industrial components, the OL-A003D ensures long-term stability. Olian Automation provides:
For engineers seeking a cost-effective 7-inch ACF laminating machine, a compact manual ACF bonder, or a single-stage thermal bonding system for rigid and flexible displays, the OL-A003D delivers exceptional value. Its blend of simplicity, safety, and precision makes it a trusted choice across global electronics manufacturing and development sectors.
Model: OL-A003D
Type: Manual Single-Edge ACF Laminating Machine
Max Panel Size: 7 inches
Press Head Length: 150 mm (standard)
Operation Mode: Manual loading/unloading, automatic bonding cycle
Target Users: Display assemblers, electronics OEMs, R&D labs, repair technicians
SEO Keywords Integrated:
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OL-A003 Semi-Automatic 12-Inch ACF Laminating Machine – Precision Thermal Bonding for LCD, FPC, and Display Module Assembly。
The OL-A003 semi-automatic ACF laminating machine by Olian Automation is a compact, high-accuracy bonding system engineered for reliable application of anisotropic conductive film (ACF) onto LCD panels, flexible printed circuits (FPCs), and printed circuit boards (PCBs). Designed for R&D labs, pilot production lines, and small-to-medium batch manufacturing, this manual ACF bonding machine supports panel sizes from 1 inch up to 12 inches, making it ideal for applications in consumer electronics, automotive displays, medical devices, and industrial HMIs.
Unlike fully automated systems that require complex integration, the OL-A003 desktop ACF bonder strikes the perfect balance between operator control and process automation. Users manually load and unload the panel, while the machine automatically handles ACF feeding, thermal compression bonding, carrier film peeling, and precision cutting—ensuring consistent results with minimal training.
The OL-A003 is built with reliability in mind. It features:
This semi-auto ACF laminator is widely used in:
For engineers and procurement teams searching for a cost-effective 12-inch ACF bonding machine, a benchtop ACF laminating system, or a manual ACF bonder with high positional accuracy, the OL-A003 delivers exceptional value. It eliminates the complexity and cost of full automation while maintaining the precision required for modern micro-electronics assembly.
Backed by Olian Automatic—a certified national high-tech enterprise specializing in LCM automation solutions—the OL-A003 combines proven engineering, robust component selection, and user-centric design into one dependable platform.
Model: OL-A003
Type: Semi-Automatic ACF Laminating Machine
Panel Size Range: 1″ to 12″
Bonding Accuracy: ±0.2 mm (X/Y)
Operation Mode: Manual loading/unloading, automatic bonding cycle
Target Industries: Display manufacturing, electronics assembly, R&D, repair
SEO Keywords Integrated:
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