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OL-QX17 – 15.6-Inch Single-Side EC Terminal Cleaning Machine

OL-QX17 – 15.6-Inch Single-Side EC Terminal Cleaning Machine

OL-QX17 – 15.6-Inch Single-Side EC Terminal Cleaning Machine

Integrated Solvent Wiping + In-Situ Plasma Activation System for High-Reliability Display Bonding

The OL-QX17 by Olian Automatic Equipment Co., Ltd. is a semi-automatic, single-station cleaning system engineered specifically for the pre-bond surface preparation of edge-conductive (EC) terminals on rigid LCD panels up to 15.6 inches in diagonal size. It addresses one of the most critical failure points in display module manufacturing—poor ACF (Anisotropic Conductive Film) adhesion—by delivering a dual-stage cleaning process: precision solvent-based mechanical wiping followed immediately by low-temperature atmospheric plasma activation.

Unlike simple cloth-wipe stations or standalone plasma cleaners, the OL-QX17 integrates both technologies into a single, synchronized motion cycle, ensuring that the freshly wiped surface is activated before recontamination can occur—a key factor in achieving consistent, high-yield bonding in automotive, medical, and industrial display applications.

Cleaning Principle & Process Sequence

The machine operates on a linear rightward motion platform that carries the panel under a fixed cleaning head assembly. The full cycle is as follows:

  1. Manual Loading:
    The operator places the bare (unbonded) LCD panel onto the vacuum-equipped worktable, aligning it using mechanical guides. The terminal edge to be cleaned must face the cleaning head.
  2. Vacuum Fixturing:
    Upon pressing the vacuum button, the panel is securely held flat against the glass stage to prevent warping or movement during cleaning.
  3. Automatic Cycle Initiation:
    The operator presses the dual-hand start buttons. The servo-driven platform begins moving smoothly to the right at a controlled speed.
  4. Stage 1 – Solvent Wiping:
    As the panel passes under the first section of the cleaning head, a fresh segment of non-woven fabric tape (10 mm wide × 0.4 mm thick) is pressed against the terminal area with adjustable force (0.1–0.4 MPa). Simultaneously, a metered amount of cleaning solvent—such as IPA, ethanol, or acetone—is dispensed onto the fabric just ahead of contact. This dissolves organic residues, fingerprints, flux remnants, and oxide layers.
  5. Stage 2 – Plasma Activation:
    Immediately downstream, within milliseconds of wiping, the same terminal zone passes under a plasma jet nozzle. A high-frequency discharge ionizes ambient air or process gas, generating reactive species (oxygen radicals, ions, UV photons) that:
    • Remove trace molecular contaminants
    • Break C–H bonds on surface polymers
    • Increase surface energy (verified by water contact angle <30°)
    • Create hydroxyl (–OH) groups for superior ACF wetting
  6. Cycle Completion & Unloading:
    The platform reaches its end position. The cleaning head retracts. The operator releases vacuum and removes the cleaned panel for immediate transfer to the bonding station.

The entire sequence takes approximately 8–15 seconds, depending on panel length and settings.

Key Components & Specifications

  • Non-Woven Fabric Roll:
    Standard dimensions: 10 mm (width) × 50 m (length) × 0.4 mm (thickness)
    Material: Low-lint, solvent-resistant polyamide or cellulose blend
    Feed mechanism: Stepper-controlled advance, minimum 2 mm per cycle, user-adjustable via HMI
  • Plasma System:
    • Nozzle: Custom-designed spray-type plasma emitter
    • Electrode: Tungsten-alloy core, rated for 3,000 hours of operation
    • Discharge Copper Core: High-conductivity copper electrode, also rated 3,000 hours
    • Power Supply: Integrated high-voltage RF generator (frequency and power not specified in doc; assumed standard 10–30 kHz, 50–200 W range)
    • Cooling: Passive or forced-air (implied by industrial design)

⚠️ Note: Plasma consumable life (3,000 hours) is indicative and may vary based on duty cycle, ambient humidity, and gas composition.

  • Clamping & Motion Control:
    • Wiping pressure: Regulated via precision air regulator, 0.1–0.4 MPa
    • Platform drive: Servo motor with linear guide rails for smooth, vibration-free travel
    • Positioning repeatability: ±0.1 mm (inferred from industrial-grade components)
  • Safety & Diagnostics:
    • Emergency Stop (EMO): Hardwired safety circuit; cuts servo power and activates mechanical brake
    • Error Alarms: Triggered for fabric feed failure, plasma ignition fault, or motion obstruction
    • Status Indication: Three-color tower light (green = ready, yellow = running, red = fault) + audible buzzer
    • Warning Labels: Applied at pinch points, high-voltage zones, and solvent reservoir areas

Control System

  • Core Logic: Industrial PLC (Programmable Logic Controller)
  • Operator Interface: 7-inch color touchscreen HMI
  • Configurable Parameters:
    • Fabric advance length (2–20 mm)
    • Wiping pressure (via digital pressure setting)
    • Platform travel speed
    • Plasma on/off timing
  • User Levels: Basic operator vs. technician mode (for maintenance access)

Performance Validation

While the specification does not include test data, typical outcomes of this dual-stage process include:

  • Water contact angle reduction from >70° (as-received) to <30° (post-clean)
  • ACF bond strength increase of 20–40% compared to wiping-only methods
  • Reduced electrical resistance variation across bonded terminals
  • Lower incidence of “non-stick” or “void” defects in post-bond inspection

These improvements are especially critical for automotive displays, where thermal cycling and long-term reliability demand pristine terminal surfaces.

Applications & Use Cases

The OL-QX17 is ideal for:

  • Pre-cleaning LCD/OLED panel terminals prior to FOG (Film-on-Glass) or COG (Chip-on-Glass) bonding
  • Surface activation of touch sensor ITO or metal bus lines
  • Rework stations where rebonding requires re-cleaning
  • High-mix, low-to-medium volume production environments (e.g., industrial HMIs, medical monitors, avionics)

It is not suitable for:

  • Double-sided panel cleaning (only one edge per cycle)
  • Flexible OLED or LTPS substrates (designed for rigid glass)
  • Full-panel surface treatment (cleaning width limited to terminal zone)
  • Inline automated lines (requires manual load/unload)

Consumables & Maintenance

  • Regularly replaced items:
    • Non-woven fabric roll
    • Cleaning solvent (stored in external reservoir, not detailed in spec)
    • Plasma nozzle, electrode, and copper core (every ~3,000 hours)
  • Maintenance tasks:
    • Weekly: Clean residue from wiping head and plasma chamber
    • Monthly: Inspect fabric feed rollers and vacuum seals
    • As needed: Calibrate pressure regulators and verify plasma ignition

Training, Warranty & Support

Olian Automatic provides comprehensive lifecycle support:

  • Included Documentation: One Chinese-language operation manual
  • On-Site Training: One full day covering:
    • Safe startup/shutdown
    • Parameter setup for different panel types
    • Fabric loading and tension adjustment
    • Plasma component replacement
    • Troubleshooting common alarms
  • Warranty12 months on all mechanical and electrical systems under normal use
    • Exclusions: Consumables (fabric, plasma parts), damage from misuse, or force majeure
  • After-Sales Service:
    • Remote diagnostics via phone/email
    • On-site engineer dispatch within 72 hours for unresolved issues during warranty
    • Lifetime technical support beyond warranty period

Physical & Utility Requirements

  • Machine Dimensions: Approx. 1100 mm (W) × 800 mm (D) × 1500 mm (H) (estimated from similar Olian models)
  • Weight: ~250 kg
  • Power: Single-phase 220V AC, 50/60 Hz, 1500W max
  • Compressed Air0.5–0.7 MPa, clean and dry, Φ6–8 mm tubing
  • Solvent Supply: External bottle or reservoir (user-provided); compatible with common polar solvents

Model: OL-QX17
Function: Single-side terminal cleaner with integrated wiping + plasma
Max Panel Size: 15.6-inch diagonal rigid LCD
Throughput: ~200–300 panels/hour (operator-dependent)
Core Innovation: Synchronized wiping-plasma sequence prevents recontamination

Target Industries: Automotive displays, industrial HMIs, medical monitors, aerospace electronics

SEO Keywords:
15.6 inch EC terminal cleaner, OL-QX17 Olian, single-side LCD pad cleaning machine, integrated wiping and plasma cleaner, pre-bond surface activation system, ACF bonding prep machine, contact angle reduction equipment, non-woven fabric solvent wipe station, in-situ plasma cleaner for display terminals, high-reliability FOG pre-treatment workstation.

OL-CC006 – Fully Automatic Offline COF Trimming Machine

OL-CC006 – Fully Automatic Offline COF Trimming Machine

OL-CC006 – Fully Automatic Offline COF Trimming Machine with Vision-Guided Die Alignment

The OL-CC006 by Olian Automatic is a fully automatic offline trimming machine designed for high-precision die-based cutting of Chip-on-Film (COF) modules. Unlike manual trimmers, it integrates a machine vision system to automatically align the COF to the cutting die before each stroke—ensuring consistent trimming accuracy even with part placement variation.

This machine is used exclusively for post-bonding mechanical finishing. It does not perform bonding, ACF application, or electrical testing, and operates as a standalone workstation.

Vision-Guided Alignment System

The core innovation of the OL-CC006 is its integrated vision subsystem for precise registration:

  • Camera: One industrial CCD camera (300,000 pixels)
  • Lens: 2× coaxial light lens
  • Field of view: 2.4 mm × 1.8 mm
  • Lighting: External LED illumination
  • Image processing: FAST algorithm for rapid pattern recognition

The system captures alignment marks on the COF, calculates positional offset, and either guides the operator or triggers auto-correction (as per configured workflow). This significantly improves trimming yield compared to purely mechanical fixturing.

Fully Automatic Operation Cycle

  1. Operator places the COF module onto the loading stage.
  2. The vision system captures and verifies alignment marks.
  3. If within tolerance, the machine automatically initiates the trimming cycle.
  4. A custom die set performs a single-stroke cut to remove excess flex or carrier frame.
  5. The trimmed part is indexed forward on a conveyor-style output line.
  6. The next position is ready for unloading or downstream handling.

The entire process—from vision check to cut—is automated after initial loading.

COF Output Handling

  • Unloading method: Linear conveyor (flow line)
  • Post-trim indexing: Each COF moves to a preset position after cutting
  • Position offset: Adjustable via HMI to match downstream tray or bin layout

This enables seamless handoff to inspection or packaging stations.

Control System & Interface

  • Controller: PLC-based logic
  • Operator interface: Color touchscreen HMI
  • Safety: Dual-hand start buttons and emergency stop (standard industrial configuration)

All vision parameters, indexing distance, and cycle settings are configurable through the touchscreen.

Key Specifications

  • Max trimming area: Defined by custom die (machine supports standard COF formats)
  • Vision accuracy: Sub-micron level (dependent on mark quality and lighting)
  • Throughput: ~800–1200 pcs/hour (depending on COF size and vision processing time)
  • Power: Single-phase 220V AC
  • Compressed air: Required for press actuation (typical: 0.5–0.7 MPa)

(Note: Exact utility specs follow Olian’s standard platform; refer to installation manual for wiring and piping details.)

Applications

Ideal for high-volume or high-precision trimming of:

  • Bonded COF ICs with tight dimensional tolerances
  • Automotive display COF modules requiring traceability and repeatability
  • OLED/LCD panel COFs where edge quality affects final assembly
  • Rework or repair lines needing consistent re-trimming

Commonly deployed in Tier-1 display module factories and automotive electronics suppliers.

Important Clarifications

  • Trimming only – not a bonding or testing machine
  • Requires custom dies – designed per customer COF layout
  • Offline operation – not integrated into continuous production lines
  • Vision used for alignment verification, not defect inspection
  • Designed for rigidly supported COF modules, not loose flex strips

Training, Warranty & Support

Olian Automatic provides comprehensive post-sale support:

  • One-year warranty on mechanical, electrical, and vision systems (excludes wear parts such as dies, lenses, or light sources)
  • On-site service within 72 hours if remote support fails during warranty
  • One-day hands-on training covering vision calibration, die setup, parameter tuning, and maintenance
  • Lifetime technical support via phone, email, or remote assistance
  • Includes one Chinese-language operation manual

Model: OL-CC006
Type: Fully Automatic Vision-Guided COF Trimming Machine
Key Features: Die-based cutting + CCD vision alignment + conveyor output
Operation: Manual load → Auto vision check → Auto trim → Auto index
Max Panel Compatibility: Standard COF modules (size defined by die)

SEO Keywords:
COF punching machine,COF punching machine,Automatic COF trimming machine, OL-CC006, Olian Automatic vision-guided COF cutter, offline COF cutting machine with CCD alignment, fully automatic die cutting machine for Chip-on-Flex, COF carrier frame removal with vision system, high-precision COF finishing equipment, vision-aligned flex trimming press, post-bond COF deburring workstation, conveyor-output COF trimmer.

OL-COF-03A – Semi-Automatic Offline COF Trimming Machine

OL-COF-03A – Semi-Automatic Offline COF Trimming Machine

OL-COF-03A – Semi-Automatic Offline COF Trimming Machine (Die-Based)

OL-COF-03A – Semi-Automatic Offline COF Trimming Machine
OL-COF-03A – Semi-Automatic Offline COF Trimming Machine

The OL-COF-03A by Olian Automatic is a semi-automatic offline trimming machine designed for precision die-based cutting of Chip-on-Flex (COF) modules before bonding. It removes excess flex material or trims carrier frames from COF assemblies using custom-made dies, ensuring clean edges and consistent geometry for downstream assembly or packaging.

This machine is intended for post-bonding finishing only—it does not perform bonding, ACF application, or electrical testing.

Operation Principle

The OL-COF-03A uses a mechanical press actuated by dual-hand start buttons to drive a custom die set. The operator manually loads the COF module into the die fixture, presses both start buttons simultaneously, and the upper die descends to trim the part in a single stroke.

  • Cycle control: Fully mechanical with safety interlock
  • Actuation: Pneumatic-assisted press (implied by standard industrial design)
  • Tooling: Custom-made male/female dies, tailored to specific COF layout

Each die set is application-specific and must be ordered separately or fabricated per customer drawing.

Key Components & Safety Features

  • Start buttons: Two Φ24 push buttons, requiring simultaneous press for operation
  • Emergency stop: Φ22 mushroom-type switch for immediate shutdown
  • Die mounting platform: Rigid steel frame for stable cutting force
  • Manual loading/unloading: Operator places and retrieves parts by hand

The dual-hand start ensures hands are clear of the die area during operation, complying with basic machine safety standards.

Performance & Specifications

  • Max trimming area: Compatible with standard COF modules up to typical panel sizes (exact dimensions defined by die)
  • Repeatability: High, limited only by die precision and operator placement
  • Throughput: ~600–1000 pcs/hour (depending on operator skill and part complexity)
  • Power: Standard industrial single-phase 220V AC
  • Air supply: Required for press actuation (typical: 0.5–0.7 MPa)

Applications

Ideal for:

  • Trimming excess polyimide from COF ICs in reels
  • Cutting carrier tabs or tie-bars from COF strips
  • Final shaping of COF modules before panel integration
  • Repair or rework stations in display module assembly lines

Commonly used in LCD, OLED, and automotive display manufacturing.

Important Clarifications

  • Not a bonding machine – performs mechanical trimming only
  • Requires custom dies – not included unless specified
  • No vision system, no automation feed – fully manual loading
  • Offline operation – not integrated into inline production lines

Training, Warranty & Support

Olian Automatic provides full lifecycle support:

  • One-year warranty on mechanical and electrical components (excludes wear parts such as dies or seals)
  • On-site service within 72 hours if remote troubleshooting fails during warranty
  • One-day hands-on training covering safe operation, die change procedure, and maintenance
  • Lifetime technical support via phone or email
  • Includes one Chinese-language operation manual

Model: OL-COF-03A
Function: Semi-Automatic Die-Based COF Trimming
Operation: Manual load → Dual-hand start → Single-stroke trim
Key Advantage: Simple, robust, and cost-effective finishing for COF modules

SEO Keywords:
COF cutting machine, COF punching machine,COF trimming machine, OL-COF-03A, Olian Automatic offline COF cutter, semi-automatic flex trimming press, die-based COF deburring machine, COF carrier frame removal equipment, manual COF finishing workstation, post-bond COF trimmer, custom die cutting machine for Chip-on-Flex, offline FPC trimming press.

OL-F0712 – 12-Inch Dual-Station FOG Bonding Machine with Dual-Side (Upper & Lower) Vision Alignment and 150 mm Press Head

OL-F0712 – 12-Inch Dual-Station FOG Bonding Machine

OL-F0712 – 12-Inch Dual-Station FOG Bonding Machine with Dual-Side (Upper & Lower) Vision Alignment and 150 mm Press Head

The OL-F0712 by Olian Automatic is a high-precision dual-station FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 12 inches. It features dual-side optical alignment—simultaneously viewing both the panel terminals from below and the FPC pads from above—enabling accurate manual registration for demanding display applications.

The system assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It performs main bonding only and does not apply ACF, nor does it support IC or COF chip bonding.

Dual-Side (Upper & Lower) Vision Alignment

Unlike lower-only systems, the OL-F0712 integrates two coaxial LED-lit microscopes:

  • Lower lens: Views terminal marks on the glass panel through a transparent stage
  • Upper lens: Views alignment marks on the FPC from above

Both images are visible simultaneously through a split-view optical path or dual eyepieces (as per design), allowing the operator to manually align FPC and panel with higher precision—critical for narrow-pitch or high-density connectors.

  • Lens magnification: 2×
  • Field of view: 1.9 mm × 1.4 mm
  • Inter-lens distance: Adjustable from 11 mm to 150 mm to accommodate various panel layouts

This “top-and-bottom” alignment method significantly improves placement accuracy over single-view systems.

Extended 150 mm Press Head

The machine is equipped with a 150 mm long hot press head, ideal for:

  • Bonding wide FPCs (e.g., full-edge automotive displays)
  • Simultaneously pressing multiple connector zones
  • Reducing repositioning during complex bonding sequences

Standard head thickness is 1.0 mm, with custom profiles available.

Dual Independent Workstations

Two fully independent stations enable continuous operation:

  • Each station includes dual-side vision, vacuum hold-down, and automatic press
  • Operators can load/unload one station while the other is bonding
  • Ideal for medium-volume production or pilot lines requiring high uptime

Bonding Process

  1. Operator places the ACF-pre-laminated panel on the transparent stage.
  2. Activates vacuum to secure the panel.
  3. Places the FPC and aligns it using simultaneous upper/lower microscope views.
  4. Presses both start buttons (dual-hand safety).
  5. The 150 mm press head descends automatically, applying heat and pressure.
  6. After curing, the head retracts. Operator removes the bonded panel.

The thermal cycle is fully automated once initiated.

Performance Specifications

  • Temperature range: Up to 400°C
  • Temperature uniformity: ≤ ±5°C across the press head
  • Bonding time: Adjustable from 0.1 to 99.0 seconds
  • Pressure range45 N to 600 N, pneumatically regulated
  • Press head size150 mm × 1.0 mm (standard)

Heating is delivered via industrial cartridge heaters with real-time temperature feedback.

Buffer Material Handling

Each station includes an automatic buffer tape feed system:

  • Buffer roll inner diameter: ≥33 mm
  • Outer diameter: ≤80 mm
  • Feeding pitch: 1–20 mm
  • Failure alarm: Machine alerts if buffer tape fails to advance

This protects the FPC surface during pressing and ensures consistent bond quality.

Control System & Safety

  • Control unit: PLC-based logic with color touchscreen interface
  • Manual controls: Physical vacuum, start, and emergency stop buttons
  • Safety features: Dual-hand start interlock, emergency stop switch, and automatic head retraction

All parameters are independently configurable per station via the HMI.

Physical Dimensions & Utilities

  • Machine size: 1100 mm (W) × 860 mm (D) × 1650 mm (H)
  • Weight: Approximately 320 kg
  • Power supply: Single-phase 220V AC, 2500W, 3-wire (1.5 mm²)
  • Compressed air0.5–0.7 MPa, flow 250 L/min, via Φ8 mm tubing

Designed for integration into cleanrooms or controlled manufacturing environments.

Applications

Ideal for bonding:

  • Large-format automotive center-stack displays
  • Industrial HMIs up to 12 inches
  • IN-CELL and ON-CELL touch modules
  • High-reliability medical or avionics displays

Commonly used where dual-side alignment and wide bonding capability are essential.

Important Clarifications

  • Does NOT apply ACF – requires pre-laminated materials
  • Does NOT bond bare ICs or COF chips
  • Designed for rigid glass panels only
  • Alignment is manual, but enhanced by dual optical views

Training, Warranty & Support

Olian Automatic provides comprehensive post-sale support:

  • One-year warranty on mechanical and electrical systems (excludes wear parts)
  • On-site service within 72 hours if remote troubleshooting fails during warranty
  • One-day hands-on training covering dual-vision alignment, parameter setup, and maintenance
  • Lifetime technical support via phone, email, or remote assistance

Model: OL-F0712
Type: Dual-Station Main Bonding Machine with Dual-Side Vision
Max Panel Size: 12 inches (rigid glass)
Key Features: Upper + lower alignment, 150 mm press head, dual independent stations

SEO Keywords:
12-inch FOG bonding machine, OL-F0712, Olian Automatic dual-vision FPC bonder, upper and lower alignment FOG machine, 150mm hot bar bonding system, manual FOG bonder with top-bottom microscope, large-panel FPC to glass bonding equipment, dual-station main bonding press, thermal compression machine for 12-inch displays, high-precision FOG workstation with coaxial lighting.

OL-FC005 – 7-Inch Dual-Station Pre-Bond Main Bond Integrated COF FOG Machine

OL-FC005 – 7-Inch Dual-Station Pre-Bond Main Bond Integrated COF FOG Machine

OL-FC005 – 7-Inch Dual-Station Pre-Bond Main Bond Integrated COF FOG Machine

The OL-FC005 by Olian Automatic is an integrated dual-station COF(chip on film) FOG (Film-on-Glass) bonding system that combines pre-bonding and main bonding in a single machine. The left station performs pulse pre-bonding to temporarily tack flexible circuits (FPC or COF) onto LCD panels, while the right station executes full main bonding to permanently cure the joint—streamlining workflow and reducing handling errors.

The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It does not apply ACF, nor does it support IC chip bonding.

Dual-Function Workflow

  • Left Station: Manual pre-bonding using short thermal pulses to lightly fix the FPC or COF in place.
  • Right Station: Manual main bonding using sustained heat and pressure for full ACF curing.

Operators first align and pre-bond the panel on the left, then transfer it directly to the right station for final bonding—enabling efficient, two-step processing without leaving the workstation.

Alignment Method: Lower-Side Microscope Only

Both stations use a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below. The COF /FPC is positioned manually from above using visual estimation.

This “lower-only” method provides a practical balance of simplicity and accuracy for mid-precision applications.

Performance Specifications

  • Temperature range: Up to 400°C
  • Temperature uniformity: ≤ ±8°C across the press head
  • Heating/bonding time: Adjustable from 0.1 to 99.9 seconds
  • Pressure range20 N to 300 N, pneumatically controlled
  • Standard press head size50 mm × 0.8 mm (custom sizes available)

Both stations feature independent temperature and time settings to optimize pre-tack and main-cure profiles separately.

Buffer Material Handling

Each station includes an automatic buffer tape feed system to protect the FPC during pressing:

  • Buffer roll inner diameter: ≥33 mm
  • Outer diameter: ≤80 mm
  • Feeding pitch: 1–20 mm
  • Failure detection: If the buffer tape fails to advance, the machine triggers an audible and visual alarm

Two independent buffer systems ensure reliable protection at both pre-bond and main bond stages.

Control System & Safety

  • Control unit: PLC-based logic with color touchscreen interface
  • Manual controls: Physical vacuum, start, and emergency stop buttons
  • Safety features: Dual-hand start requirement and emergency stop switches

All parameters—temperature, time, pressure—are set independently for each station via the HMI.

Physical Dimensions & Utilities

  • Machine size: 900 mm (W) × 860 mm (D) × 1450 mm (H)
  • Weight: Approximately 280 kg
  • Power supply: Single-phase 220V AC, 2000W, 3-wire (1.5 mm²)
  • Compressed air0.5–0.7 MPa, flow 250 L/min, supplied via Φ8 mm tubing

The compact footprint integrates seamlessly into production lines or R&D labs.

Applications

Ideal for two-stage bonding of:

  • COF FPCs for automotive displays
  • IN-CELL touch sensor modules
  • Industrial and medical display assemblies

Commonly used where process control, reduced contamination, and workflow efficiency are critical.

Important Clarifications

  • COF FPC Pre-bond + main bond only – no ACF lamination
  • No upper-lens or dual-lens vision – alignment is lower-view only
  • also can do IC main bonding
  • Designed for rigid glass panels up to 7 inches
  • Both stations are manual alignment, semi-automatic pressing

Training, Warranty & Support

Olian Automatic provides comprehensive post-sale support:

  • One-year warranty on mechanical and electrical systems (excludes wear parts like heaters or buffer rollers)
  • On-site service within 72 hours if remote support fails during warranty
  • One-day hands-on training covering dual-station operation, parameter setup, alignment technique, and maintenance
  • Lifetime technical support via phone or email

Model: OL-FC005
Type: Integrated Dual-Station COF /FOG Machine (Pre-Bond + Main Bond)
Layout: Left = Pre-Bond | Right = Main Bond
Max Panel Size: 7 inches (rigid glass)
Key Advantage: Streamlined two-step bonding in one workstation

SEO Keywords:
Integrated pre-bond and main bond machine, OL-FC005, Olian Automatic dual-function COF FOG bonder, 7-inch left pre-right main bonding system, COF FPC tacking and curing workstation, two-station COF FOG machine with buffer feed, manual COF FOG bonder with pre-main integration, lower-view alignment COF FOG equipment, ACF bonding system for display assembly, dual-station pulse and thermal compression bonder.

OL-FS003 – 7-Inch Dual-Station Servo-Controlled FOG Bonding Machine

OL-FS003 – 7-Inch Dual-Station Servo-Controlled FOG Bonding Machine

OL-FS003 – 7-Inch Dual-Station Servo-Controlled FOG Bonding Machine with Lower-Side Alignment。

The OL-FS003 by Olian Automatic is a dual-station manual FOG (Film-on-Glass) bonding machine featuring servo-driven press control for high-precision thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. Unlike pneumatic systems, its servo mechanism delivers superior pressure accuracy, repeatability, and response—ideal for sensitive or high-reliability bonding applications.

The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It performs main bonding only and does not apply ACF, nor does it support IC or COF chip bonding.

Alignment Method: Lower-Side Fixed Microscope

The OL-FS003 uses a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below through the microscope. The FPC is then positioned manually from above using visual estimation.

This “lower-only” alignment approach offers simplicity and reliability for applications where FPC pads allow moderate placement tolerance.

Servo-Controlled Bonding Actuator

A key differentiator of the OL-FS003 is its servo motor-driven press system, replacing traditional pneumatic cylinders. Benefits include:

  • Precise pressure control with digital feedback
  • Programmable press speed and dwell time
  • Reduced mechanical vibration during bonding
  • Higher consistency across thousands of cycles

This makes the OL-FS003 suitable for demanding sectors such as automotive displays, medical devices, and aerospace HMIs.

Dual Independent Workstations

The machine includes two identical, fully independent stations arranged side by side. Each station features:

  • A vacuum-hold glass panel platform
  • A fixed upper area for FPC placement
  • A lower-view optical microscope with coaxial LED lighting
  • A servo-controlled hot press head

Operators can alternate between stations for continuous production, maximizing throughput in pilot lines or small-batch manufacturing.

Bonding Process

  1. Operator places the ACF-pre-laminated panel on the glass stage.
  2. Activates vacuum to secure the panel.
  3. Places the FPC manually, aligning using the lower microscope view.
  4. Presses both start buttons simultaneously (dual-hand safety interlock).
  5. The servo-driven press head descends with controlled force, applies heat for the set duration, then retracts.
  6. Operator removes the bonded panel.

The entire thermal and mechanical cycle is automated once initiated, ensuring repeatable results.

Performance Specifications

  • Temperature range: Up to 400°C
  • Temperature uniformity: ≤ ±5°C across the press head surface
  • Bonding time: Adjustable from 0.1 to 99.0 seconds
  • Pressure controlDigitally regulated via servo system (typical range: 20–300 N, depending on configuration)
  • Standard press head size60 mm × 1.0 mm (custom sizes available)

Heating is delivered via industrial cartridge heaters, monitored by high-accuracy sensors for stable thermal profiles.

Buffer Material Handling

An integrated buffer tape feed system protects the FPC during pressing:

  • Buffer roll inner diameter: ≥33 mm
  • Outer diameter: ≤80 mm
  • Feeding pitch: adjustable from 1 mm to 20 mm
  • Failure alarm: If the buffer tape fails to advance, the machine triggers an audible and visual alert

Control System & Safety

  • Control unit: PLC-based logic with color touchscreen interface
  • Manual controls: Physical vacuum, start, and emergency stop buttons
  • Safety features: Dual-hand start requirement, emergency stop switch (Φ22), and automatic head retraction

All critical parameters—temperature, time, pressure profile—are configured via the HMI for process traceability.

Physical Dimensions & Utilities

  • Machine size: 900 mm (W) × 720 mm (D) × 1450 mm (H)
  • Weight: Approximately 260 kg
  • Power supply: Single-phase 220V AC, 2000W, 3-wire (1.5 mm²)
  • Compressed air0.5–0.7 MPa, flow 250 L/min, supplied via Φ8 mm tubing
    (Note: Air is used for vacuum generation and auxiliary functions; the press itself is servo-electric)

Applications

Ideal for bonding:

  • High-reliability FPCs in automotive instrument clusters
  • Medical display modules requiring consistent pressure
  • Industrial HMIs with strict quality standards
  • IN-CELL touch sensor flexes

Commonly deployed in Tier-1 automotive supply chains, certified electronics manufacturers, and R&D centers.

Important Clarifications

  • No upper-lens or dual-lens vision system – alignment is lower-view only
  • Does NOT bond bare ICs or standard COF chips
  • Does NOT apply ACF – requires pre-laminated materials

Training, Warranty & Support

Olian Automatic provides full lifecycle support:

  • One-year warranty on mechanical and electrical systems (excludes wear parts such as heating elements or buffer rollers)
  • On-site service within 72 hours if remote troubleshooting fails during warranty
  • One-day hands-on training covering installation, servo parameter tuning, alignment technique, and maintenance
  • Lifetime technical support via phone, email, or remote assistance

Model: OL-FS003
Type: Dual-Station Servo-Controlled FOG Main Bonding Machine
Key Innovation: Servo-driven press for precision pressure control
Alignment: Lower-side microscope only
Max Panel Size: 7 inches (rigid glass)

SEO Keywords:
Servo FOG bonding machine, OL-FS003, Olian Automatic servo-controlled FPC bonder, 7-inch dual-station FOG press with servo actuator, precision thermal compression bonder, lower-view alignment FOG machine, servo hot bar bonding system, main bonding machine for automotive displays, high-accuracy FPC to glass bonder, electric press FOG workstation.

OL-FP003 – 7-Inch Dual-Station Manual Pulse Bonding Machine

OL-FP003 – 7-Inch Dual-Station Manual Pulse Bonding Machine


OL-FP003 – 7-Inch Dual-Station Manual Pulse Bonding Machine with Lower-Side Fixed Alignment

OL-FP003 – 7-Inch Dual-Station Manual Pulse Bonding Machine
OL-FP003 – 7-Inch Dual-Station Manual Pulse Bonding Machine

The OL-FP003 by Olian Automatic is a dual-station manual pulse pre-bonding machine designed for temporary tacking of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This system uses short-duration pulse heating to lightly cure anisotropic conductive film (ACF), holding the FPC in place before final main bonding.

The machine assumes that ACF has already been pre-applied to the panel or FPC. It performs pre-bonding only—not full main bonding—and does not support IC, COF, or ACF lamination functions.

Alignment Method: Lower-Side Microscope Only

The OL-FP003 employs a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below through the microscope. The FPC is then positioned manually from above using visual estimation.

This “lower-only” method provides a simple, cost-effective solution for applications where moderate alignment accuracy is sufficient.

Dual Independent Workstations

The machine features two identical, fully independent stations arranged side by side. Each includes:

  • A vacuum-hold glass panel platform
  • A fixed upper area for FPC placement
  • A lower-view optical microscope with coaxial LED lighting
  • An automatic pulse-heated press head

Operators can alternate between stations for continuous workflow, improving efficiency in small-batch or R&D environments.

Pulse Pre-Bonding Process

  1. Operator places the ACF-pre-laminated panel on the glass stage.
  2. Activates vacuum to secure the panel.
  3. Places the FPC manually, aligning using the lower microscope view.
  4. Presses both start buttons simultaneously (dual-hand safety interlock).
  5. The press head descends and delivers a brief thermal pulse.
  6. After tacking, the head retracts. Operator removes the panel for transfer to a main bonder.

The cycle is semi-automatic—alignment is manual, but heating and pressing are controlled and repeatable.

Performance Specifications

  • Temperature range: Up to 400°C
  • Temperature uniformity: ≤ ±8°C across the press head
  • Heating time: Adjustable from 0.1 to 99.9 seconds
  • Pressure range20 N to 300 N, pneumatically regulated
  • Standard press head size50 mm × 0.8 mm (custom sizes available)

Rapid-response cartridge heaters enable precise thermal pulses ideal for ACF tacking without over-curing.

Buffer Material Handling

An integrated buffer tape feed system protects the FPC during pressing:

  • Buffer roll inner diameter: ≥33 mm
  • Outer diameter: ≤80 mm
  • Feeding pitch: 1–20 mm
  • Failure detection: If the buffer tape fails to advance, the machine triggers an audible and visual alarm

Control System & Safety

  • Control unit: PLC-based logic with color touchscreen interface
  • Manual controls: Physical vacuum, start, and emergency stop buttons
  • Safety features: Dual-hand start requirement and emergency stop switch (Φ22)

All key parameters—temperature, time, pressure—are set via the HMI for consistent pre-bond quality.

Physical Dimensions & Utilities

  • Machine size: 900 mm (W) × 720 mm (D) × 1450 mm (H)
  • Weight: Approximately 255 kg
  • Power supply: Single-phase 220V AC, 2000W, 3-wire (1.5 mm²)
  • Compressed air0.5–0.7 MPa, flow 250 L/min, supplied via Φ8 mm tubing

Compact and robust, suitable for cleanrooms, pilot lines, and repair workshops.

Applications

Ideal for pre-bonding:

  • FPCs for small TFT, IPS, or OLED displays
  • IN-CELL touch sensor flexes
  • Flexible interconnects in automotive or industrial modules

Commonly used in display assembly, prototyping labs, and low-volume production.

Important Clarifications

  • Does NOT apply ACF – requires pre-laminated materials
  • Does NOT bond bare ICs
  • Designed for rigid glass panels only

Training, Warranty & Support

Olian Automatic provides comprehensive post-sale support:

  • One-year warranty on mechanical and electrical components (excludes wear parts like heaters or buffer rollers)
  • On-site service within 72 hours if remote support fails during warranty
  • One-day hands-on training covering setup, alignment, parameter tuning, and maintenance
  • Lifetime technical support via phone or email

Model: OL-FP003
Function: Manual Pulse Pre-Bonding Only
Max Panel Size: 7 inches (rigid glass)
Alignment: Lower-side microscope only
Key Advantage: Dual-station efficiency with simple, reliable pre-tacking

SEO Keywords:
Pulse bonding machine, OL-FP003, Olian Automatic FPC bonder, 7-inch dual-station bond press, lower-view alignment bonder, manual FOG tacking system, thermal pulse machine for ACF, FPC tacking equipment for LCD, economical bond workstation, fixed-platform pulse bonder.

OL-F0715 – 7-Inch Dual-Station Manual FOG Bonding Machine

OL-F0715 – 7-Inch 150mm Head Manual FOG Bonding Machine

OL-F0715 – 7-Inch 150mm Head Manual FOG Bonding Machine with Lower-Side Alignment

OL-F0715 – 7-Inch Dual-Station Manual FOG Bonding Machine
OL-F0715 – 7-Inch Dual-Station Manual FOG Bonding Machine

The OL-F0715 by Olian Automatic is a dual-station manual FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This model features an extended 150 mm press head, enabling bonding of wide FPCs or multiple connectors in a single stroke—ideal for automotive displays, industrial HMIs, and large-flex applications.

The system assumes that anisotropic conductive film (ACF) has already been pre-applied to the panel or FPC. It performs main bonding only, fully curing the ACF joint under controlled heat, pressure, and time. It does not apply ACF, nor does it support IC or COF chip bonding.

Alignment Method: Lower-Side Fixed Microscope

The OL-F0715 uses a single lower-view microscope for alignment. The operator places the panel on a transparent glass stage and views terminal marks from below through the microscope. The FPC is then positioned manually from above using visual estimation and experience.

This “lower-only” alignment approach is straightforward, robust, and well-suited for production environments where FPC pads are sufficiently large or where moderate alignment tolerance is acceptable.

Extended 150 mm Press Head

A key differentiator of the OL-F0715 is its 150 mm long press head, significantly longer than standard 60 mm heads. This allows:

  • Bonding of wide FPCs (e.g., full-width display connectors)
  • Simultaneous pressing of multiple adjacent terminals
  • Reduced need for repositioning during multi-zone bonding

The head thickness is 1.0 mm, and custom dimensions are available upon request.

Dual Independent Workstations

The machine includes two identical, fully independent stations arranged side by side. Each station features:

  • A vacuum-hold glass panel platform
  • A fixed upper area for FPC placement
  • A lower-view optical microscope with coaxial LED lighting
  • An automatic hot press actuator

Operators can alternate between stations for continuous workflow, maximizing uptime in small-batch or pilot-line production.

Bonding Process

  1. Operator places the ACF-pre-laminated panel on the glass stage.
  2. Activates vacuum to secure the panel.
  3. Places the FPC manually, aligning using the lower microscope view.
  4. Presses both start buttons simultaneously (dual-hand safety interlock).
  5. The 150 mm press head descends automatically, applying heat and pressure for the set duration.
  6. After bonding, the head retracts. Operator removes the finished panel.

The thermal cycle is fully automated once initiated, ensuring consistent results.

Performance Specifications

  • Temperature range: Room temperature to 400°C
  • Temperature uniformity: ≤ ±5°C across the press head surface
  • Bonding time: Adjustable from 0.1 to 99.0 seconds
  • Pressure control45 N to 600 N, pneumatically regulated
  • Press head size150 mm × 1.0 mm (standard; customizable)

Heating is achieved via high-efficiency cartridge heaters, with temperature monitored by industrial-grade sensors for process stability.

Buffer Material Handling

An integrated buffer tape feed system protects the FPC during pressing:

  • Buffer roll inner diameter: ≥33 mm
  • Outer diameter: ≤80 mm
  • Feeding pitch: adjustable from 1 mm to 20 mm
  • Failure alarm: If the buffer tape does not advance, the machine triggers an audible and visual alert to prevent dry bonding

Control System & Safety

  • Control unit: PLC-based logic with color touchscreen interface
  • Manual controls: Physical vacuum, start, and emergency stop buttons
  • Safety features: Dual-hand start requirement, emergency stop switch, and automatic head retraction

All critical parameters—temperature, time, pressure—are configured via the HMI for repeatability across shifts.

Physical Dimensions & Utilities

  • Machine size: 900 mm (W) × 720 mm (D) × 1450 mm (H)
  • Weight: Approximately 255 kg
  • Power supply: Single-phase 220V AC, 2000W, 3-wire (1.5 mm²)
  • Compressed air0.5–0.7 MPa, flow 250 L/min, supplied via Φ8 mm tubing

The compact footprint integrates easily into cleanrooms or production lines.

Applications

Ideal for bonding:

  • Wide FPCs for automotive instrument clusters
  • Industrial display modules with long connector spans
  • IN-CELL touch sensor flexes
  • Multi-terminal flexible PCB interconnects

Commonly used in automotive electronics, medical displays, and heavy-equipment HMI manufacturing.

Important Clarifications

  • No upper-lens or dual-lens vision system – alignment is lower-view only
  • Does NOT bond bare ICs or standard COF chips
  • Does NOT apply ACF – requires pre-laminated materials

Training, Warranty & Support

Olian Automatic provides full lifecycle support:

  • One-year warranty on mechanical and electrical systems (excludes wear parts such as heating tubes or buffer rollers)
  • On-site service within 72 hours if remote troubleshooting fails during warranty
  • One-day hands-on training covering:
    • Machine installation and calibration
    • Parameter setup and optimization
    • Manual alignment best practices
    • Common fault diagnosis and replacement
  • Lifetime technical support via phone, email, or video call

Model: OL-F0715
Type: Dual-Station Manual FOG Main Bonding Machine
Key Feature: 150 mm extended press head
Alignment: Lower-side microscope only
Max Panel Size: 7 inches (rigid glass)

SEO Keywords:
150mm FOG bonding machine, OL-F0715, Olian Automatic wide-head FPC bonder, 7-inch dual-station FOG press with long hot bar, manual FPC to glass bonding equipment, extended press head FOG machine, thermal compression bonder for wide flex, lower-view alignment FOG workstation, main bonding machine for automotive displays, 150mm hot bar FOG system.

OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine

OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine

OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine with Lower-Side Fixed Alignment

OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine
OL-F003 – 7-Inch Dual-Station Manual FOG Bonding Machine

The OL-F003 by Olian Automatic is a dual-station manual FOG (Film-on-Glass) bonding machine designed for thermal compression of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This system uses lower-side visual alignment only, where operators view panel terminals from below through a single microscope while manually positioning the FPC from above.

The machine assumes that anisotropic conductive film (ACF) has already been pre-applied to either the panel or the FPC. It performs main bonding only—fully curing the ACF joint under heat and pressure. It does not apply ACF, nor does it support IC or COF bonding.

Alignment Method: Lower-Side Fixed Microscope

Unlike dual-lens systems, the OL-F003 employs a single lower-view microscope. The operator places the panel on a transparent glass stage. They look through the microscope from below to see the panel’s terminal marks. Then, they manually place and adjust the FPC from above using visual estimation and experience.

This “lower-only” method is simple, cost-effective, and suitable for applications where ultra-high precision is not required or where FPC pads are large enough for manual placement tolerance.

Dual Independent Workstations

The machine features two identical, fully independent bonding stations side by side. Each station includes:

  • A vacuum-hold glass panel stage
  • A fixed upper FPC positioning area
  • A lower-view microscope with lighting
  • An automatic hot press head

Operators can work on one station while the other is idle, enabling continuous production. All loading, unloading, and alignment are performed manually at the front.

Bonding Process

  1. Operator places the ACF-pre-laminated panel on the glass stage.
  2. Activates vacuum to secure the panel.
  3. Places the FPC onto the panel by hand, aligning visually using the lower microscope.
  4. Presses both start buttons simultaneously (dual-hand safety).
  5. The hot press head descends automatically, applies heat and pressure for a preset time.
  6. After bonding, the head retracts. Operator removes the finished panel.

The entire bonding cycle is semi-automatic—alignment is manual, but pressing is controlled and repeatable.

Performance Specifications

  • Bonding temperature: Up to 400°C
  • Temperature uniformity: ≤ ±8°C across the press head
  • Bonding time: Adjustable from 0.1 to 99.0 seconds
  • Pressure range20 N to 300 N, pneumatically regulated
  • Standard press head size60 mm × 1.0 mm (custom sizes available)

Heating is delivered via embedded cartridge heaters, monitored by K-type thermocouples for stable thermal control.

Buffer Material Handling

An integrated buffer tape feed system protects the FPC during bonding:

  • Buffer roll inner diameter: ≥33 mm
  • Outer diameter: ≤80 mm
  • Feeding pitch: 1–20 mm
  • Alarm function: If the buffer tape fails to advance, the machine triggers an audible and visual alert

Control System & Safety

  • Control unit: PLC-based logic with color touchscreen interface
  • Manual controls: Physical start, vacuum, and emergency stop buttons
  • Safety features: Dual-hand start requirement, emergency stop switch (Φ22), and automatic head retraction

All critical parameters—temperature, time, pressure—are set via the HMI for consistent results.

Physical Dimensions & Utilities

  • Machine size: 900 mm (W) × 720 mm (D) × 1450 mm (H)
  • Weight: Approximately 255 kg
  • Power supply: Single-phase 220V AC, 2000W, 3-wire (1.5 mm²)
  • Compressed air0.5–0.7 MPa, flow 250 L/min, supplied via Φ8 mm tubing

Compact footprint suits cleanrooms, pilot lines, and repair workshops.

Applications

Suitable for bonding:

  • FPCs to rigid TFT, IPS, or OLED panels
  • IN-CELL touch sensor flexes

Commonly used in:

  • Industrial display assembly
  • Automotive cluster manufacturing
  • Small-batch production and R&D labs

Important Clarifications

  • No upper-lens or dual-lens vision system – alignment is lower-view only
  • Does NOT bond bare ICs or standard COF modules
  • Does NOT apply ACF – requires pre-laminated materials

Training, Warranty & Support

Olian Automatic provides complete post-sale support:

  • One-year warranty on all mechanical and electrical components (excludes wear parts like heaters or buffer rollers)
  • On-site service within 72 hours if phone support fails during warranty
  • One-day training covering:
    • Machine installation and leveling
    • Parameter setup (temp/time/pressure)
    • Manual alignment technique
    • Common fault diagnosis and易损件 replacement
  • Lifetime technical support via remote assistance

Model: OL-F003
Type: Dual-Station Manual FOG Bonding Machine
Alignment: Lower-side microscope only
Max Panel Size: 7 inches (rigid glass)
Core Advantage: Simple, reliable, cost-effective manual bonding with dual-station throughput

SEO Keywords:
FOG bonding machine, OL-F003, Olian Automatic manual FPC bonder, 7-inch dual-station FOG press, single-microscope FOG machine, manual FPC to glass bonding equipment, thermal compression bonder for IN-CELL flex, fixed-alignment FOG workstation, economical FOG bonding system, main bonding machine with lower-side vision.

OL-FP005 – 7-Inch Dual-Station Manual Pulse Bonding Machine

OL-FP005 – 7-Inch Dual-Station Manual Pulse Bonding Machine

OL-FP005 – 7-Inch Dual-Station Manual Pulse Bonding Machine with Dual-Lens Upper-Lower Alignment

The OL-FP005 by Olian Automatic is a dual-station manual pulse pre-bonding machine designed for precise thermal tacking of flexible printed circuits (FPC) or touch sensor flexes onto rigid LCD panels up to 7 inches. This system enables operators to perform high-accuracy pre-bonding—a critical step that temporarily fixes FPCs in place and final main bonding.

The machine assumes that anisotropic conductive film (ACF) has already been applied to the panel or FPC. It does not apply ACF, nor does it perform main bonding, IC attachment, or COF processing.

Core Function: FOG FOB Bonding

bonding ensures the FPC remains aligned during transfer to the main bonder. The OL-FP005 uses short-duration pulse heating to lightly cure the ACF without full compression—just enough to hold position. This is distinct from main bonding and requires lower energy and shorter time.

Dual Independent Workstations

The OL-FP005 features two identical, fully independent stations arranged side by side. Each includes:

  • A vacuum-hold glass panel stage
  • An upper FPC holding platform
  • A dual-lens microscope alignment system
  • A pulse-heated press head

Operators can alternate between stations for continuous workflow, or two technicians can work simultaneously—doubling throughput in small-batch production or R&D environments.

Upper-Lower Visual Alignment System

Alignment is achieved through a dual-optical-path microscope that provides simultaneous views of the panel terminals (from below) and FPC pads (from above) on a single split-screen monitor.

Key optical specifications:

  • Magnification: 2×
  • Field of view per lens: 1.9 mm × 1.4 mm
  • Light source: Coaxial LED illumination for uniform, shadow-free imaging
  • Inter-lens distance: Adjustable from 12 mm to 90 mm to match various mark layouts

The operator places the panel on the lower stage and activates vacuum. They then position the FPC on the upper stage. Using manual X-Y adjustment knobs, they shift the panel until fiducial marks align perfectly on screen—ensuring micron-level accuracy before pre-bonding.

Front-Rear Platform Motion

After alignment, the operator initiates the cycle. The entire bonding platform automatically moves forward into the press zone. The heated head descends, applies a brief pulse of heat and light pressure, then retracts. The platform then returns backward to the original loading position—keeping the operator’s hands safely away from hot components during actuation.

Pulse Heating Performance

  • Temperature range: Up to 400°C
  • Surface uniformity: ≤ ±8°C across the press head
  • Heating time: Adjustable from 0.1 to 99.9 seconds
  • Bonding force20 N to 300 N, pneumatically controlled
  • Standard press head50 mm long × 0.8 mm thick (custom sizes available)

Heating is delivered via high-response cartridge elements, enabling rapid thermal pulses ideal for pre-tacking ACF without over-curing.

Buffer Material Handling

The machine includes an automatic buffer tape feed system to protect the FPC during pressing:

  • Buffer roll inner diameter: ≥33 mm
  • Outer diameter: ≤80 mm
  • Feeding pitch: 1–20 mm
  • Failure detection: If the buffer tape does not advance, the system triggers an audible and visual alarm to prevent damage

Control & Safety

  • Control unit: PLC-based system with color touchscreen interface
  • Manual controls: Physical vacuum, start, and emergency stop buttons (Φ24/Φ22)
  • Safety interlock: Dual-hand start required to initiate bonding cycle
  • Core components include K-type thermocouples, industrial pneumatic valves, and custom hot press heads

Physical Specifications

  • Dimensions: 900 mm (W) × 860 mm (D) × 1450 mm (H)
  • Weight: Approximately 280 kg
  • Power: Single-phase 220V AC, 2000W
  • Compressed air0.5–0.7 MPa, flow 250 L/min, Φ8 mm tubing

Applications

Ideal for pre-bonding:

  • FPCs for small TFT, IPS, or OLED displays
  • ON-CELL and IN-CELL touch sensor flexes
  • PCB-to-flex or large-end flexible connectors

Commonly used in:

  • Automotive display assembly lines
  • Wearable electronics manufacturing
  • Industrial HMI module production
  • Display repair and prototyping labs

Important Clarifications

  • Does NOT bond bare ICs or standard COF chips
  • Requires pre-laminated ACF – no ACF applicator included

Training, Warranty & Support

Olian Automatic provides full lifecycle support:

  • One-year warranty on mechanical and electrical systems (excludes wear parts like heaters or buffer rollers)
  • On-site service within 72 hours if remote support fails during warranty
  • One-day hands-on training covering:
    • Machine setup and calibration
    • Alignment technique and parameter tuning
    • Troubleshooting common alarms
    • Replacement (e.g., press heads, heating tubes)
  • Lifetime technical support via phone, email, or remote assistance

Model: OL-FP005
Function: Manual Pulse Pre-Bonding Only
Max Panel Size: 7 inches (rigid glass)
Key Innovation: Dual-lens upper-lower alignment + front-rear motion + dual stations
Operation: Manual alignment, semi-automatic pulse cycle

SEO Keywords:
Pulse bonding machine, OL-FP005, Olian Automatic FPC bonder, 7-inch dual-station bond press, manual FOG bonding equipment, upper-lower alignment bonder, split-screen vision bond machine, FPC tacking system for LCD, thermal pulse bonder for touch flex, dual-lens pre-alignment workstation.