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5-17.3 Inch Mid-Size LOAD/EC/COG/FOG/FPC Production Line

5-17.3 Inch Mid-Size LOAD/EC/COG/FOG/FPC Production Line

5-17.3 Inch Mid-Size LOAD/EC/COG/FOG/FPC Production Line.

Engineered for High-Mix, High-Precision Display Manufacturing

This document details Olian Automatic’s turnkey solution for mid-size display module assembly (5″–17.3″), focusing on LOAD (Panel Handling), EC (End-to-end Cleaning), COG (Chip-on-Glass), COF (Chip-on-Film), FOG (Film-on-Glass), and FPC (Flexible Printed Circuit) loading processes. Designed for rigid and flexible panel substrates, this production line integrates robotics, vision systems, and precision bonding technologies to achieve sub-micron accuracy and support high-mix production environments.

1. Production Line Overview

Core Capabilities

  • Size Range: Supports 5″ to 17.3″ displays (16:9 aspect ratio) with substrate thicknesses from 0.15mm to 0.7mm and (warpage) ≤0.2mm.
  • High-Mix Flexibility: Accommodates up to 4 ICs (adjacent sides) and 2 FPCs per panel, with dual material loading for non-stop loading.
  • Throughput: Achieves 4–20 seconds per unit, depending on configuration (e.g., 6.5 sec for single IC on 12″ panels).
  • Precision Standards:
    • ACF (Anisotropic Conductive Film) placement: ±0.15mm
    • COG bonding: ±5μm
    • FOG bonding: ±15–20μm

Process Flow

The production line follows a sequential workflow:

  1. Panel Loading (OL-LLD3000): Automated tray handling with Z-axis servo stacking.
  2. Terminal Cleaning (OL-EC3000): Dual-side ITO cleaning via alcohol wiping + plasma activation.
  3. COG/COF Bonding (OL-CB3000): ACF dispensing, IC pre-bonding, and main bonding with vision-guided alignment.
  4. FOG Bonding (OL-FB3000): FPC alignment, ACF application, and thermal compression.
  5. FPC Loading (OL-FLD3000): Dual-channel FPC feeding for 1–2 FPC types.
  6. COF Punching (Optional): Servo-driven die-cutting with ±50μm accuracy for COF tape reels.

2. Equipment Specifications

2.1 Panel Loader (LLD3000)

Function: Automated loading of panel trays (400×460mm max) with Y-axis pneumatic correction.

  • Capacity: Handles 80×80mm to 380×380mm panels, supporting full-pallet width limits.
  • Throughput: 4 seconds for 7″ panels (with >4 units per tray).
  • Design: Dual (material wells) for pre-stocked panels and empty tray storage.

2.2 Terminal Cleaner (EC3000)

Function: Fully automated multi-edge plasma terminal cleaning.

  • Cleaning Process: Pneumatic double sides cleaning with alcohol dispensing and PT300 plasma units.
  • Vision System: Beijing Boshii CCD cameras for positional accuracy (X: ±0.5mm, Y: ±0.1mm).
  • Plasma Specifications:
    • Power: 120–200W
    • Frequency: 18kHz–60kHz
    • Temperature: 60°C–100°C (adjustable via line speed).

2.3 COG Bonder (CB3000)

Function: Full-process IC bonding with ACF application, pre-press, and main press.

  • IC Handling: Supports MIN: 4×0.5mm to MAX: 45×2mm ICs, with dual materials wells for non-stop loading.
  • Bonding Heads:
    • ACF head: SUS440C (HRC 52–58), 5.0×70mm
    • Pre-press head: SUS440C, 2×60mm (dual sets)
    • Main press heads: Tungsten steel, 5×50mm (dual Short Bar groups)
  • Vision Alignment: 300k-pixel cameras with 0.5× lenses for input correction and 1300k-pixel cameras with 6× lenses for pre-press alignment.

2.4 COF Punching Machine (Optional)

Function: Servo-driven COF tape feeding with CCD-guided punching.

  • Accuracy: ±50μm (requires qccuracy ≤±15μm and mode accuracy ≤±5μm).
  • Cycle Time: 3.5–4.5 seconds per unit.
  • Reel Compatibility: φ405–600mm outer diameter with φ25.4mm inner diameter.

2.5 FOG Bonder (FB3000)

Function: FPC-to-glass bonding with Long Bar bonding heads and dual-channel FPC feeding.

  • FPC Support: Standard/U-shaped FPCs up to 200×165mm.
  • Bonding Heads:
    • ACF head: SUS440C, 5.0×165mm
    • Pre-press head: SUS440C, 1.8×165mm
    • Main press heads: SUS440C, 1×200mm (dual Long Bar groups)
  • Platform Design: Molybdenum alloy with super-hard oxidation for durability.

2.6 FPC Loader (FLD3000)

Function: Dual-channel FPC feeding with tray-to-bonder transfer.

  • Tray Compatibility: 250×220mm to 400×460mm trays.
  • Accuracy: ±0.03mm handling precision with below-arm vacuum pickup.
  • Cycle Time: 4 seconds (single FPC type) or 6 seconds (dual loading one by one).

3. Technical Advantages

3.1 Automation & Integration

  • Robotic Handling: Linear motor-driven arms for panel/FPC transfer between stations.
  • Modular Design: Stations support standalone operation or inline integration via interface ports.
  • Scalability: Optional USC (Ultrasonic Cleaning) modules and plasma units for enhanced adhesion.

3.2 Precision Engineering

  • Thermocompression Control: Dual servo-pneumatic systems ensure consistent pressure (20–500N) and temperature (200°C max).
  • Vision Systems: Real-time CCD correction compensates for substrate warpage or misalignment, with torque motor tension control for ACF/COF feeding.

3.3 Process Reliability

  • ACF Quality Control: Inline vision inspection verifies film placement before bonding.
  • Plasma Activation: PT300 plasma units enhance adhesion with water contact angles of 15°–30°.

4. Applications & Industry Impact

This solution targets high-mix manufacturing of:

  • Automotive Displays: Ensures reliability under 85°C/85% RH conditions with multi-segment ACF application.
  • Consumer Electronics: Enables ultra-narrow bezels with <0.1mm pitch bonding for foldable OLEDs.
  • Industrial Panels: Supports ruggedized designs with redundant IC bonding for mission-critical systems.

By integrating LOAD, EC, COG, FOG, and FPC processes into a single line, manufacturers reduce handling errors by 40% and achieve 25% faster changeover times for batch switching.

5. Future-Proof Design

The production line accommodates emerging trends:

  • AI Integration: Vision systems support machine learning for defect prediction (e.g., void prediction via thermal imaging).
  • Scalable I/O: Modular stations allow addition of AOI (Automated Optical Inspection) or curing modules.

6. After-Sales Support & Quality Assurance

  • VIP Service: 30-minute response time, 24/7 support, and lifetime maintenance.
  • Quality system: DQA (Design Quality Assurance) protocols, ESD protection, and whole-machine acceptance testing.
  • Certifications: ISO 9001, National High-Tech Enterprise, and Specialized SME.

SEO Keywords: Mid-size display production line, COG bonding machine, FOG bonding equipment, ACF application system, plasma cleaning for displays, high-precision display assembly, FPC loading system, COF punching machine.COG FOG Bonding production line.

7-17 Inch Mid-Size EC/COG/FOG Production Line

7-17 Inch Mid-Size EC/COG/FOG Production Line

7-17 Inch Mid-Size EC/COG/FOG Production Line

Engineered for Precision, Scalability, and High-Throughput Display Manufacturing

This is automated solution for mid-size display module assembly (7″–17″), focusing on EC (End-to-end Cleaning), COG (Chip-on-Glass), and FOG (Film-on-Glass) processes. Designed for rigid panel substrates, this production line integrates advanced robotics, vision systems, and precision bonding technologies to achieve sub-micron accuracy and high-efficiency throughput.

1. Production Line Overview

Core Capabilities

  • Size Range: Supports 7″ to 17″ displays (16:9 aspect ratio) with substrate thicknesses from 0.2mm to 1.1mm.
  • Multi-Component Handling: Accommodates up to 6 ICs per side and 4 FPCs per side (expandable to 8 with optional configurations).
  • Throughput: Achieves 12 seconds per unit for a configuration with 4 ICs and 2 FPCs.
  • Precision Standards:
    • ACF (Anisotropic Conductive Film) placement: ±0.15mm
    • COG bonding: ±5μm
    • FOG bonding: ±15μm

Process Flow

The production line follows a sequential workflow:

  1. Platform Conveyor System: Transports substrates between stations.
  2. Terminal Cleaning (EC1001): Automated alcohol wiping + plasma treatment.
  3. COG Bonding (CB1100/CB1162): ACF dispensing, IC pre-bonding, and main bonding.
  4. FOG Bonding (FB1142): FPC alignment, ACF application, and thermal compression.
  5. Outfeed Conveyor: Final product handling.

2. Equipment Specifications

2.1 Terminal Cleaning Station (EC1001)

Function: Automated ITO terminal cleaning for both S-side and G-side substrates.

  • Cleaning Process: Dual-stage alcohol wiping followed by plasma activation.
  • Vision System: Beijing Boshii image processing for positional accuracy (X: ±0.5mm, Y: ±0.1mm).
  • Throughput: 9 seconds per cycle (for 12″ substrates at 80mm/s wiping speed).
  • Plasma Specifications:
    • Power: 300W
    • Frequency: 18kHz–60kHz
    • Temperature: 90°C–100°C
  • Dimensions: 1970mm (L) × 1250mm (W) × 2000mm (H).

2.2 COG Bonding Stations (CB1100 & CB1162)

Function: Full-process IC-to-glass bonding with ACF application, pre-press, and main press.

  • IC Handling: Supports ICs from 5.0×0.8mm to 35×4mm, with dual-IC type compatibility.
  • Vision Alignment: Beijing Boshii system ensures ±5μm total bonding accuracy.
  • Bonding Heads:
    • ACF head: SUS 440C, 4.0×60mm
    • Pre-press head: SUS 440C, 3×30mm (servo + pneumatic)
    • Main press heads: Ceramic/tungsten steel, 5.0×40mm (dual servo-pneumatic groups)
  • Throughput: 125 seconds for 2+2 IC configuration on 12″ substrates.
  • Dimensions: 6700mm (L) × 1650mm (W) × 2000mm (H).

2.3 FOG Bonding Station (FB1142)

Function: FPC-to-glass bonding with integrated ACF application and thermal compression.

  • FPC Support: Handles FPCs up to 35×4mm (length ≤100mm).
  • Precision: ±15μm total bonding accuracy with vision-guided alignment.
  • Bonding Heads:
    • ACF head: SUS 440C, 4.0×40mm
    • Pre-press head: SUS 440C, 3×60mm (servo + pneumatic)
    • Main press heads: SUS 440C (dual servo-pneumatic groups)
  • Throughput: 12 seconds per unit (for 2 FPCs on 12″ substrates).
  • Dimensions: 4000mm (L) × 1465mm (W) × 2000mm (H).

3. Technical Advantages

3.1 Automation & Integration

  • Robotic Handling: Linear motor-driven robotic arms for substrate transfer between stations.
  • Modular Design: Stations support standalone operation or inline integration.
  • Scalability: Optional LCD/FPC loaders for fully automated material handling.

3.2 Precision Engineering

  • Thermocompression Control: Dual servo-pneumatic systems ensure consistent pressure (0.2–0.8MPa) and temperature (350°C–450°C).
  • Vision Systems: Real-time CCD correction compensates for substrate warpage or misalignment.

3.3 Process Reliability

  • ACF Quality Control: Inline vision inspection verifies film placement before bonding.
  • Plasma Activation: PT300 plasma units enhance adhesion with water contact angles of 20°–30°.

4. Applications & Industry Impact

This solution targets high-volume manufacturing of:

  • Automotive Displays: Ensures reliability under 85°C/85% RH conditions.
  • Consumer Electronics: Enables ultra-narrow bezels with <0.1mm pitch bonding.
  • Industrial Panels: Supports ruggedized designs with multi-IC redundancy.

By integrating cleaning, COG, and FOG processes into a single line, manufacturers reduce handling errors, minimize footprint, and achieve 20% faster time-to-market.

5. Future-Proof Design

The production line accommodates emerging trends:

  • AI Integration: Vision systems support machine learning for defect prediction.
  • Scalable I/O: Modular stations allow addition of AOI (Automated Optical Inspection) or curing modules.

SEO Keywords: Mid-size display production line, COG bonding machine, FOG bonding equipment, ACF application system, plasma cleaning for displays, high-precision display assembly.

COF Bonding Machines

COF Bonding Machines Precision Engineering for Modern Display Manufacturing

COF Bonding Machines Precision Engineering for Modern Display Manufacturing.

Semi automatic COF COF COP Bonding Machine
Pre bonding and main bonding COF Bonding Machine
mini manual COF Bonding Machine
COF pre Bonding Machine
COF final Bonding Machine
3 IN 1 ACF Attaching pre bonding main bonding COF Bonding Machines
17inch FOB COF Bonding Machine
COF Repairing machine COF Bonding Machine
17inch FOB FOG COF Bonding Machine
COF bonding machine
cof acf bonding machine
cof main bonding machine
cof pre bonding machine
cof cutting machine
COF Bonding Machines
semi automatic COF Bonding Machine
COF Bonding Machine
ACF attaching machine
COF Bonding Machine
COF Bonding Machine
COF Bonding Machine
COF Bonding Machine
COF Bonding Machine
COF Bonding Machines
1-7 inch full automatic cof bonding production line
3.5s 1-7 inch full automatic cof bonding production line
7-17 inch full automatic cof bonding production line

In the rapidly evolving world of display technology, the COF bonding machine (Chip-on-Film bonding equipment) stands as a cornerstone for high-precision assembly in OLED, LCD, and emerging flexible display production. This comprehensive guide explores the working principles, industrial applications, maintenance best practices, and future trends of COF bonding machines, empowering manufacturers to optimize yield, reliability, and innovation.

1. How COF Bonding Machines Work: From Theory to Precision Engineering

COF bonding machines enable the integration of driver ICs onto flexible film substrates (COF), which are then bonded to display panels (e.g., glass or plastic substrates). The process relies on three core technologies:

1.1. Thermocompression Bonding

A heated bonding tip applies precise temperature (typically 350–450°C) and pressure (0.2–0.8 MPa) to create electrical and mechanical connections between the IC bumps (e.g., gold or solder) and the panel’s electrodes. Advanced machines use pulse-heating technology with ±0.1°C temperature uniformity to prevent thermal damage to sensitive components.

1.2. Vision Alignment Systems

High-resolution CCD cameras and AI-powered image processing enable sub-micron alignment accuracy (±0.05 mm). This ensures perfect registration between the COF’s IC pads and the display’s electrode patterns, critical for high-resolution screens.

1.3. Automated Workflow Integration

Modern COF bonders feature dual-stage worktables, allowing simultaneous pre-bonding (alignment) and main bonding (compression). This parallel processing boosts throughput to 600–1,200 units per hour, meeting mass-production demands.

2. Industrial Applications: Where COF Bonding Machines Excel

2.1. Smartphone OLED Displays

For curved or foldable OLED panels, COF bonding machines handle flexible PCBs (FPCs) with minimal warpage. Adaptive pressure control (0.2–0.8 MPa) and anti-static designs prevent damage to delicate organic materials.

2.2. Automotive Displays

In harsh environments (85°C/85% humidity), COF bonding ensures long-term reliability. Features like ACF (Anisotropic Conductive Film) auto-cutting improve moisture resistance, extending module lifespan to over 10,000 hours.

2.3. Mini/Micro LED Backlighting

High-density Mini LED arrays require precise bonding of 128+ driver ICs. Modular bonding heads enable multi-zone simultaneous processing, reducing cycle times by 30%.

2.4. Wearable Devices

Ultra-narrow bezel designs demand COF bonding with <0.1 mm pitch accuracy. Machines with nano-positioning stages (e.g., piezoelectric actuators) achieve this, enabling “borderless” displays.

3. Maintenance & Troubleshooting: Maximizing Uptime

Proactive maintenance prevents costly downtime. Key strategies include:

3.1. Common Issues & Solutions

Misalignment greater than 0.1 mm is often caused by vision system calibration drift and can be corrected by recalibrating using PV310 alignment tools. A high void rate exceeding 5% typically results from non-uniform tip temperature, which can be addressed by replacing the tungsten-carbide heater and optimizing finite element method (FEM) parameters. ACF film jams are usually due to vacuum suction failure and can be prevented by cleaning or replacing vacuum nozzles on a regular basis.

3.2. Preventive Maintenance Checklist

It is recommended to clean CCD lenses and laser sensors daily to prevent dust-induced errors. Pressure sensors should be calibrated monthly within the 0.2–0.8 MPa range to ensure linearity error remains below 1%. Additionally, inspecting bonding tip wear and replacing it if surface roughness exceeds 0.5 µm should be performed quarterly.

4. Future Trends: AI and Beyond

The next generation of COF bonding machines will integrate:

4.1. AI-Driven Predictive Maintenance

Thermal imaging sensors combined with machine learning models, such as BERT, analyze vibration spectra to predict bonding defects up to 24 hours in advance, reducing scrap rates by 40%.

4.2. Self-Optimizing Processes

AI algorithms, including reinforcement learning, automatically tune temperature and pressure curves based on real-time yield data, cutting setup time by 30%.

4.3. Sub-Micron Bonding for AR/VR

As AR/VR displays demand pixel pitches under 10 µm, COF bonders will adopt laser-assisted alignment and atomic-force microscopy (AFM) feedback for nanometer-scale precision.

Conclusion: Staying Ahead in Display Manufacturing

Mastering COF bonding machine technology is no longer optional—it’s a competitive necessity. By understanding core principles, implementing rigorous maintenance, and embracing AI-driven innovation, manufacturers can achieve:

  • Yield improvements (99%+ first-pass yield),
  • Cost reductions (30% lower rework rates),
  • Faster time-to-market for next-gen displays.

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OL-3B20 Fully Automatic Particle Dent AOI Inspecting Machine

OL-3B20 Fully Automatic Particle Dent AOI Inspecting Machine

OL-3B20 Fully Automatic Particle Dent AOI Inspecting Machine,Automated Optical Inspection (AOI) systems

High-Speed Dual-Side Inspection for 5–17.6″ Displays

Engineered by Olian Automaic

  • Developed by Olian Automaic, a Shenzhen-based leader in automation equipment.
  • Designed for automated detection of conductive particle count, strength, distribution uniformity, and offset measurement in COG/FOG/COF applications.
  • Supports display sizes from 5 inches (110×62 mm) to 17.6 inches (390×220 mm) with material thicknesses of 0.25–2 mm (excluding polarizer).

Core Functionality

  • Dual-Side Inspection: Simultaneously analyzes IC and FPC bonding areas for defects.
  • Particle Analysis: Measures particle count, distribution uniformity (up to 10 segments), and offset accuracy (±1.5 μm).
  • Defect Detection: Automatically identifies foreign objects, cracks, dimples, scratches, and corrosion in the bump area.

Key Specifications

  • Platform Size:
    • Overall dimensions: 3000 mm (L) × 1500 mm (W) × 1750 mm (H).
    • Conveyor height: 1000 mm ± 20 mm.
  • Display Compatibility:
    • Max: 17.6″ (390×220 mm).
    • Min: 5″ (110×62 mm).
    • Thickness: 0.25–2 mm (excluding polarizer).
  • IC/FPC Specifications:
    • IC length: 5–64 mm; width: 0.4–1.8 mm.
    • FPC bonding area: <64 mm (bonding side); <120 mm (non-bonding side).
  • Production Capacity:
    • Cycle time: ≤5 seconds per panel (1 IC + 1 FPC).
    • Throughput: ≥720 units/hour (dual-station operation).

Technical Features

  1. Imaging System:
    • Line-Scan Camera:
      • Resolution: 3200×128 pixels.
      • Field of view: 1.8 mm (width) × scanning length.
      • Pixel size: 0.7 μm/pixel.
      • Auto-focus capability.
    • Area-Scan Camera:
      • 5 MP monochrome camera for Mark alignment.
      • Field of view: 14×14 mm.
  2. Motion Control:
    • Loading/Unloading Arms:
      • Vacuum suction for panel handling.
      • X-axis: Linear motor; Z-axis: Servo motor.
    • Dual Detection Platforms:
      • Vacuum fixation with alternating inspection cycles.
      • Y-axis servo motor + rotary servo motor (R-axis).
  3. Defect Detection:
    • Crack Detection:
      • Accuracy: 5×30 μm (bump area).
    • Foreign Object Detection:
      • Accuracy: 5×30 μm (bump area).
    • Dimple/Scratch Detection:
      • Configurable filtering options.

Performance Metrics

  • Detection Accuracy:
    • Particle count repeatability: ±10%.
    • Offset detection accuracy: ±1.5 μm.
  • Yield Rate: ≥99% (excluding human error and material defects).
  • Failure Rate: ≤0.05% (missed detection); ≤1% (false detection).
  • Changeover Time:
    • New models: ≤60 minutes.
    • Existing models: ≤20 minutes.

Operational Environment

  • Cleanroom Requirements: Class 100 (ISO 5).
  • Temperature: 25°C ± 5°C.
  • Humidity: 50–80%.
  • Power Supply: Single-phase AC 220V, 4.5 kW, 50/60 Hz.
  • Air Supply: 0.5–0.7 MPa, 300 L/min (φ12 tubing).
  • Vacuum Supply: -50 to -80 kPa, 250 L/min (φ12 tubing).

Safety and Compliance

  • Emergency Stop: EMO button halts all motion.
  • ESD Protection: Grounding impedance ≤5 Ω; surface static <±100 V.
  • Safety Labels: Multilingual warnings at high-risk zones.
  • Access Control:
    • Operator mode: No password (basic operation).
    • Engineer mode: Password-protected (parameter settings).

After-Sales Support

  • Warranty: 1 year (excludes wear parts and human-induced damage).
  • Training: 1-day on-site program covering operation, calibration, and troubleshooting.
  • Service: 72-hour on-site response for warranty-period issues.

Target Applications

Ideal for manufacturers of:

  • Mid-size LCD/OLED panels (e.g., tablets, monitors).
  • Touchscreen modules and automotive displays.
  • Industrial control screens and digital signage.

SEO Keywords

AOI,AOI MACHINE, AOI INSPECTION MACHINE, AOI INSPECTING MACHINE,OL-3B20, particle dent detection machine, conductive particle analyzer, FOG defect detector, COG inspection system, Olian Automaic, display module testing, glass-to-film bonding inspection, high-speed lamination checker, industrial display quality control, China automation equipment, cleanroom-compatible inspector, precision defect detection, display production line, OLB quality tester, FOB inspection solution, reliable particle counter, high-yield display manufacturing.Automated Optical Inspection (AOI) systems

OL-3A20 Fully Automatic Particle Dent AOI Detection Machine

OL-3A20 Fully Automatic Particle Dent AOI Detection Machine

OL-3A20 Fully Automatic Particle Dent Detection Machine

High-Speed Inspection for 0.96–10.1″ Displays

Engineered by Olian Automaic

  • Developed by Olian Automaic, a Shenzhen-based leader in automation equipment.
  • Designed for automated detection of conductive particle count, strength, distribution uniformity, and offset measurement in COG/FOG/COF applications.
  • Supports display sizes from 0.96 inches (21×12 mm) to 10.1 inches (205×154 mm) with material thicknesses of 0.25–2 mm (excluding polarizer).

Core Functionality

  • Defect Detection: Automatically identifies and classifies defects (foreign objects, cracks, dimples, scratches, etc.) in the bump area.
  • Particle Analysis: Measures particle count, distribution uniformity (up to 10 segments), and offset accuracy (±1.5 μm).
  • Dual-Station Inspection: Alternates between two detection platforms to maximize throughput.

Key Specifications

  • Platform Size:
    • Overall dimensions: 1700 mm (L) × 1300 mm (W) × 1750 mm (H).
    • Conveyor height: 1000 mm ± 20 mm.
  • Display Compatibility:
    • Max: 10.1″ (205×154 mm).
    • Min: 0.96″ (21×12 mm).
    • Thickness: 0.25–2 mm.
  • IC/FPC Specifications:
    • IC length: 5–64 mm; width: 0.4–1.8 mm.
    • FPC bonding area: <64 mm (bonding side); <120 mm (non-bonding side).
  • Production Capacity:
    • Cycle time: ≤3 seconds per panel (1 IC, 30 mm length).
    • Throughput: ≥50 units/hour (excluding manual loading/unloading).

Technical Features

  1. Imaging System:
    • Line-Scan Camera:
      • Resolution: 3200×128 pixels.
      • Field of view: 1.8 mm (width) × scanning length.
      • Pixel size: 0.7 μm/pixel.
      • Auto-focus capability.
    • Area-Scan Camera:
      • 5 MP monochrome camera for Mark alignment.
      • Field of view: 14×14 mm.
  2. Motion Control:
    • Loading/Unloading Arms:
      • Vacuum suction for panel handling.
      • X-axis: Linear motor; Z-axis: Servo motor.
    • Detection Platforms:
      • Dual-platform design with vacuum fixation.
      • Y-axis servo motor + rotary servo motor (R-axis).
  3. Defect Detection:
    • Crack Detection:
      • Accuracy: 5×30 μm (bump area).
    • Foreign Object Detection:
      • Accuracy: 5×30 μm (bump area).
    • Dimple/Scratch Detection:
      • Configurable filtering options.

Performance Metrics

  • Detection Accuracy:
    • Particle count repeatability: ±10%.
    • Offset detection accuracy: ±1.5 μm.
  • Yield Rate: ≥99% (excluding human error and material defects).
  • Failure Rate: ≤0.05% (missed detection); ≤1% (false detection).
  • Changeover Time:
    • New models: ≤60 minutes.
    • Existing models: ≤20 minutes.

Operational Environment

  • Cleanroom Requirements: Class 100 (ISO 5).
  • Temperature: 25°C ± 5°C.
  • Humidity: 50–80%.
  • Power Supply: Single-phase AC 220V, 4.5 kW, 50/60 Hz.
  • Air Supply: 0.5–0.7 MPa, 300 L/min (φ12 tubing).
  • Vacuum Supply: -50 to -80 kPa, 250 L/min (φ12 tubing).

Safety and Compliance

  • Emergency Stop: EMO button halts all motion.
  • ESD Protection: Grounding impedance ≤5 Ω; surface static <±100 V.
  • Safety Labels: Multilingual warnings at high-risk zones.
  • Access Control:
    • Operator mode: No password (basic operation).
    • Engineer mode: Password-protected (parameter settings).

After-Sales Support

  • Warranty: 1 year (excludes wear parts and human-induced damage).
  • Training: 1-day on-site program covering operation, calibration, and troubleshooting.
  • Service: 72-hour on-site response for warranty-period issues.

Target Applications

Ideal for manufacturers of:

  • Small-to-medium LCD/OLED panels (e.g., smartphones, tablets).
  • Touchscreen modules and automotive displays.
  • Industrial control screens and wearable devices.

SEO Keywords

AOI,AOI machine，AOI inspection machine， AOI inspecting machine，OL-3A20, particle dent detection machine, conductive particle analyzer, FOG defect detector, COG inspection system, Olian Automaic, display module testing, glass-to-film bonding inspection, high-speed lamination checker, industrial display quality control, China automation equipment, cleanroom-compatible inspector, precision defect detection, display production line, OLB quality tester, FOB inspection solution, reliable particle counter, high-yield display manufacturing.

OL-WB650 Automatic Mesh Plate Laminating Machine

OL-WB650 Automatic Mesh Plate Laminating Machine

OL-WB650 Automatic Mesh Plate Laminating Machine

OL-WB650 Automatic Mesh Plate Laminating Machine
OL-WB650 Automatic Mesh Plate Laminating Machine

High-Precision Lamination for 65-Inch Displays

Engineered by Olian Automaic

  • Developed by Olian Automaic, a Shenzhen-based leader in automation equipment.
  • Designed for precision laminating of glass/film (G+F) and film-to-glass products, including touch panels and display modules.
  • Supports screen sizes from 23 inches (500×280 mm) to 65 inches (1500×800 mm) with material thicknesses of 0.1–1.6 mm (glass) and 0.1–0.3 mm (film).

Core Functionality

  • Mesh Box Lamination: Uses a mesh box structure with roller-based lamination for soft-to-hard material bonding.
  • 4CCD Vision Alignment: Four cameras capture edge markers on glass and film for sub-millimeter alignment accuracy.
  • Semi-Automatic Process: Operators load materials; the system automates alignment, flipping, and roller lamination.

Key Specifications

  • Platform Size:
    • Flip plate: 1600×900 mm.
    • Mesh box: 1800×960 mm.
  • Display Compatibility:
    • Max: 65″ (1500×800 mm).
    • Min: 23″ (500×280 mm).
    • Thickness: 0.1–1.6 mm (glass), 0.1–0.3 mm (film).
  • Roller Specifications:
    • Diameter: φ48 mm.
    • Width: 830 mm (effective stroke: ≤1550 mm).
    • Hardness: 60 Shore (customizable).
  • Production Capacity:
    • Cycle time: ～35 seconds per unit (excluding manual loading/unloading).

Technical Features

  1. 4CCD Vision System:
    • 4× 1.3-megapixel cameras with coaxial and ring lighting.
    • Field of view: 10.0×7.4 mm.
    • Alignment accuracy: ±0.15 mm (excluding material defects).
  2. Adjustable Platforms:
    • Flip Plate:
      • Servo-driven flip mechanism with减速机.
      • Platform flatness: ±0.01 mm/100 mm.
    • Mesh Box:
      • Vacuum fixation (1 mm holes, 1.5 mm grooves).
      • Servo-driven X/Y/Q axes (ball screw + linear guide).
  3. Lamination System:
    • Servo-driven roller with precision pressure control (0.1–0.6 MPa).
    • Roller speed: Adjustable up to 100 mm/s.

Performance Metrics

  • Yield Rate: ≥99% (excluding human error and material defects).
  • Failure Rate: ≤2% under normal conditions.
  • Changeover Time:
    • New models: ≤60 minutes.
    • Existing models: ≤30 minutes.

Operational Environment

  • Cleanroom Requirements: Class 100 (ISO 5).
  • Temperature: 23°C ±5°C.
  • Humidity: 60% ±15%.
  • Power Supply: Single-phase AC 220V, 50/60 Hz, 4500W.
  • Air Supply: 0.5–0.7 MPa, 250 L/min (φ8 mm yellow tubing).
  • Vacuum System:
    • Flip plate: Vacuum pump.
    • Mesh box: Blower.
    • Consumption: 200 L/min.

Safety and Compliance

  • ESD Protection:
    • Static elimination at material contact points.
    • Grounding impedance: ≤5 Ω.
    • Surface static: <±100 V.
  • Safety Features:
    • Interlock design with buzzer and alarm alerts.
    • EMO (Emergency Stop) halts all motion.
    • Warning labels at high-temperature and pinch points.

After-Sales Support

  • Warranty: 1 year (excludes wear parts and human-induced damage).
  • Training: 1-day on-site program covering operation, calibration, and troubleshooting.
  • Service: 72-hour on-site response for warranty-period issues.

Target Applications

Ideal for manufacturers of:

  • Large LCD/OLED panels (e.g., TVs, automotive displays).
  • Touchscreen modules and optical film assemblies.
  • Industrial control screens and digital signage.

SEO Keywords

OL-WB650, mesh plate laminating machine, 65-inch display laminator, 4CCD alignment laminator, G+F lamination equipment, automatic roller laminator, Olian Automaic, display module assembly, glass-to-film bonding, precision lamination system, touch panel equipment, soft-hard material laminator, industrial display machinery, China automation equipment, cleanroom-compatible laminator, high-yield display manufacturing, display production line, optical film bonder,

OL-FBM037 Flip-Board Mounting Machine

OL-FBM037 Flip-Board Mounting Machine

OL-FBM037 Flip-Board Mounting Machine

High-Precision Semi-Automatic Mounting for Medium-to-Large Displays

Engineered by Olian Automaic

  • Developed by Olian Automaic, a Shenzhen-based leader in automation equipment.
  • Designed for semi-automatic high-precision mounting of flexible circuits (FPC/COF) onto hard boards or flexible films.
  • Supports display sizes from 7 inches (160×88 mm) to 32 inches (710×400 mm) with material thicknesses of 0.1–1 mm.

Core Functionality

  • Semi-Automatic Operation: Operators place soft boards (FPC) on the lower platform and hard boards/soft films on the flip platform. The system automates alignment and pressing.
  • Single-Sided Mounting: Optimized for pre-mounting applications in medium-to-large display manufacturing.
  • Dual-Platform Design: Flip platform (620×920 mm) and lower platform (620×920 mm) for efficient workflow.

Key Specifications

  • Platform Size:
    • Flip platform: 620×920 mm.
    • Lower platform: 620×920 mm.
  • Display Compatibility:
    • Max: 32″ (710×400 mm).
    • Min: 7″ (160×88 mm).
    • Thickness: 0.1–1 mm.
  • FPC/COF Dimensions:
    • Length/Width: 12–60 mm.
    • Thickness: 0.1–1 mm.
    • Step gap between small glass and IC/COF: ≥0.4 mm.
  • Roller Specifications:
    • Diameter: φ50 mm.
    • Length: 648 mm.
    • Hardness: Standard 60 Shore (customizable).
  • Production Capacity:
    • Cycle time: <40 seconds per unit (excluding loading/unloading and cleaning).
    • Mounting speed: ≥100 mm/s.

Technical Features

  1. Precision Mounting System:
    • Roller Drive: Servo motor + ball screw + linear guide.
    • Pressure Control: 0.2–0.4 MPa (adjustable).
    • Alignment Accuracy: X/Y-axis ≤±0.1 mm (excluding human/material errors).
  2. Adjustable Platforms:
    • Flip Platform:
      • Servo-driven Q-axis rotation.
      • Vacuum fixation (1 mm holes, 1.5 mm grooves).
    • Lower Platform:
      • Servo-driven X/Y-axis movement (left/right) + UVW alignment.
      • Material: Hard-anodized aluminum.
  3. Control System:
    • PLC: Panasonic.
    • HMI: Weintek.
    • Servo Motor: Panasonic.

Performance Metrics

  • Yield Rate: ≥98% (excluding human error and material defects).
  • Failure Rate: ≤2% under normal conditions.
  • Changeover Time:
    • New models: ≤30 minutes.
    • Existing models: ≤10 minutes.

Operational Environment

  • Cleanroom Requirements: Class 100 (ISO 5).
  • Temperature: 22–27°C.
  • Humidity: 40–70%.
  • Power Supply: Single-phase AC 220V, 50/60 Hz, 2000W.
  • Air Supply: 0.4–0.7 MPa, 150 L/min (φ8 mm transparent tubing).
  • Vacuum System:
    • Self-generated vacuum.
    • Consumption: 66 L/min (yellow tubing).

Safety and Compliance

  • Emergency Stop: EMO button halts all motion.
  • Warning Labels: Placed at high-temperature and pinch points.
  • Access Control:
    • Operator mode: No password (basic operation).
    • Engineer mode: Password-protected (parameter settings).

After-Sales Support

  • Warranty: 1 year (excludes wear parts and human-induced damage).
  • Training: 1-day on-site program covering operation, calibration, and troubleshooting.
  • Service: 72-hour on-site response for warranty-period issues.

Target Applications

Ideal for manufacturers of:

  • Medium-to-large LCD/OLED panels (e.g., monitors, TVs).
  • Touchscreen modules and optical film assemblies.
  • Automotive displays and industrial control screens.

SEO Keywords

OL-FBM037, flip-board mounting machine, semi-automatic FPC mounter, 32-inch display equipment, precision mounting system, Olian Automaic, display module assembly, glass-to-film bonding, FPC bonding machine, COF mounting solution, industrial display machinery, China automation equipment, cleanroom-compatible mounter, high-yield display manufacturing, display production line, UVW alignment system, servo-driven mounter, thermocompression bonding, manual loading machine, reliable mounting solution.

OL-WB215A Automatic 4CCD Mesh Plate Laminating Machine

OL-WB215A Automatic 4CCD Mesh Plate Laminating Machine

OL-WB215A Automatic 4CCD Mesh Plate Laminating Machine

High-Precision Lamination for 21.5-Inch Displays

Engineered by Olian Automaic

  • Developed by Olian Automaic, a Shenzhen-based leader in automation equipment.
  • Designed for precision laminating of glass/film (G+F) and film-to-glass products, including touch panels and display modules.
  • Supports screen sizes from 7 inches (160×88 mm) to 21.5 inches (443×350 mm) with material thicknesses of 0.1–0.3 mm.

Core Functionality

  • Mesh Box Lamination: Uses a mesh box structure with roller-based lamination for soft-to-hard material bonding.
  • 4CCD Vision Alignment: Four cameras capture edge markers on glass and film for sub-millimeter alignment accuracy.
  • Manual Loading/Automatic Process: Operators load materials; the system automates alignment, flipping, and roller lamination.

Key Specifications

  • Platform Size:
    • Flip plate: 480×360 mm.
    • Mesh box: 645×465 mm.
  • Display Compatibility:
    • Max: 21.5″ (443×350 mm).
    • Min: 7″ (160×88 mm).
    • Thickness: 0.1–0.3 mm.
  • Roller Specifications:
    • Diameter: θ34 mm.
    • Width: 380 mm.
    • Hardness: 45 Shore (customizable).
  • Production Capacity:
    • Cycle time: ～21 seconds per unit.
    • Output: >50 mm/s (equipment motion only).

Technical Features

  1. 4CCD Vision System:
    • 4× 1.3-megapixel cameras with coaxial and ring lighting.
    • Field of view: 10.0×7.4 mm.
    • Alignment accuracy: ±0.1 mm (excluding material defects).
  2. Adjustable Platforms:
    • Flip Plate:
      • Pneumatic flip mechanism with gear-rack drive.
      • Platform flatness: ±0.01 mm/100 mm.
    • Mesh Box:
      • Vacuum fixation (1 mm holes, 1.5 mm grooves).
      • Step motor + ball screw + linear guide drives (X/Y/Q axes).
  3. Lamination System:
    • Servo-driven roller with precision pressure control (0.1–0.6 MPa).
    • Roller speed: Adjustable up to 50 mm/s.

Performance Metrics

  • Yield Rate: ≥99% (excluding human error and material defects).
  • Failure Rate: ≤2% under normal conditions.
  • Changeover Time:
    • New models: ≤60 minutes.
    • Existing models: ≤30 minutes.

Operational Environment

  • Cleanroom Requirements: Class 100 (ISO 5).
  • Temperature: 23°C ±5°C.
  • Humidity: 60% ±15%.
  • Power Supply: Single-phase AC 220V, 50/60 Hz, 2000W.
  • Air Supply: 0.5–0.7 MPa, 250 L/min (φ8 mm yellow tubing).
  • Vacuum System:
    • Flip plate: Vacuum generator.
    • Mesh box: Blower.
    • Consumption: 200 L/min.

Safety and Compliance

  • ESD Protection:
    • Static elimination at material contact points.
    • Grounding impedance: ≤5 Ω.
    • Surface static: <±100 V.
  • Safety Features:
    • Interlock design with buzzer and alarm alerts.
    • EMO (Emergency Stop) halts all motion.
    • Warning labels at high-temperature and pinch points.

After-Sales Support

  • Warranty: 1 year (excludes wear parts and human-induced damage).
  • Training: 1-day on-site program covering operation, calibration, and troubleshooting.
  • Service: 72-hour on-site response for warranty-period issues.

Target Applications

Ideal for manufacturers of:

  • Smartphone and tablet displays (G+F lamination).
  • Touchscreen panels and optical film modules.
  • Industrial control screens and automotive displays.

SEO Keywords

OL-WB215A, mesh plate laminating machine, 21.5-inch display laminator, 4CCD alignment laminator, G+F lamination equipment, automatic roller laminator, Olian Automaic, display module assembly, glass-to-film bonding, precision lamination system, touch panel equipment, soft-hard material laminator, industrial display machinery, China automation equipment, cleanroom-compatible laminator, high-yield display manufacturing, display production line, optical film laminator,

OL-FS120 Single-Station Servo-Driven FOG Bonder

OL-FS120 Single-Station Servo-Driven FOG Bonder

OL-FS120 Single-Station Servo-Driven FOG Bonder

High-Precision Manual FOG Bonding for 120-Inch Displays

Engineered by Olian Automaic

  • Developed by Olian Automaic, a Shenzhen-based leader in automation equipment.
  • Designed for manual single-head servo-driven FOG bonding on panels with pre-attached anisotropic conductive film (ACF).
  • Supports display sizes from 25 inches (550×320 mm) to 120 inches (2700×1500 mm) with material thicknesses of 0.1–1 mm.

Core Functionality

  • Manual Loading/Alignment: Operators place LCD panels and FPCs manually, aligning via Mark points using a dual-camera imaging system.
  • Automated Thermocompression: After alignment, the system executes precision thermocompression bonding.
  • Single-Station Design: Optimized for pre-bonding applications in large-format display manufacturing.

Key Specifications

  • Platform Size: 2800 mm (W) × 2000 mm (D).
  • Display Compatibility:
    • Max: 120″ (2700×1500 mm).
    • Min: 25″ (550×320 mm).
    • Thickness: 0.1–1 mm.
  • FPC Dimensions: 12–60 mm (L×W); Thickness: 0.1–1 mm.
  • Production Capacity: Single-section bonding with cycle time ≤20 seconds per unit (excluding manual alignment).
  • Bonding Time: <10 seconds per unit.

Technical Features

  1. Precision Bonding System:
    • Main Press Head:
      • Material: Tungsten steel.
      • Surface Flatness: ≤±3 μm (45 mm standard).
      • Temperature Range: RT–400°C (constant-temperature heating).
      • Pressure Control: 25–400 N (±3 N precision).
    • Backup Plate: Quartz material (standard: customizable).
  2. Adjustable Platforms:
    • LCD Platform:
      • Fixed position with ±2 mm Z-axis adjustment (micrometer).
      • Vacuum fixation (1 mm holes, 1.5 mm grooves) with分区 control (300×300 mm units).
      • Platform Material: Hard-anodized aluminum.
      • Platform Flatness: ≤±8 μm/100 mm.
    • FPC Platform: Manual X/Y/Q/Z-axis adjustment.
  3. Servo-Driven Motion:
    • X-axis: Servo motor + gear rack + linear guide.
    • Z-axis: Servo motor + ball screw + linear guide.
  4. Imaging System:
    • Dual 300K-pixel CCD cameras with coaxial LED lighting.
    • Field of View: 3.2×2.4 mm.

Performance Metrics

  • Alignment Accuracy: X/Y-axis ≤±0.035 mm (excluding human/material errors).
  • Minimum Pitch Support: ≥80 μm.
  • Platform Repeatability: ≤0.01 mm.
  • Model Changeover Time: ≤10 minutes (new product setup).

Operational Environment

  • Power Supply: Single-phase AC 220V, 50/60 Hz, 2000W.
  • Air Supply: 0.4–0.7 MPa, 250 L/min (φ8 mm transparent tubing).
  • Vacuum: Self-generated; ≥-60 kPa (yellow tubing).
  • Conditions: Cleanroom (22–27°C, 40–70% humidity).

After-Sales Support

  • Warranty: 1 year (excludes wear parts and human-induced damage).
  • Training: 1-day on-site program covering operation, calibration, and troubleshooting.
  • Service: 72-hour on-site response for warranty-period issues.

Target Applications

Ideal for manufacturers of ultra-large LCD/OLED panels, including:

  • Television displays (85–120 inches).
  • Digital signage and industrial monitors.
  • Automotive infotainment systems.

SEO Keywords

FOG bonding machine,FOG bonder,COF bonder ,COF bonding machine,OL-FS120, single-station FOG bonder, 120-inch display equipment, servo-driven heat press, FPC bonding machine, thermocompression bonding system, large-format display assembler, Olian Automaic, manual FOG bonder, high-precision alignment bonder, flat panel display equipment, constant-temperature bonder, display module assembly, glass-to-film bonding, industrial display machinery, China automation equipment, reliable FOG bonder, cleanroom-compatible bonder, high-yield display manufacturing, display production line, precision display assembler.

OL-OLB120-T Single-Side Multi-Section OLB Bonder

OL-OLB120-T Single-Side Multi-Section OLB Bonder

OL-OLB120-T Single-Side Multi-Section OLB Bonder

High-Efficiency Semi-Automatic Heat Press for Large-Format Displays

Engineered by Olian Automaic

  • Developed by Olian Automaic, a Shenzhen-based leader in automation equipment.
  • Designed for semi-automatic thermocompression bonding of chip-on-film (COF) to LCD panels with pre-attached anisotropic conductive film (ACF).
  • Supports display sizes from 25 inches (550×320 mm) to 120 inches (2700×1500 mm) with material thicknesses of 0.1–1 mm.

Core Functionality

  • Manual Loading/Alignment: Operators place LCD panels and COF manually, aligning via Mark points using a dual-camera imaging system.
  • Automated Bonding: The system executes precision thermocompression after alignment.
  • Single-Side Multi-Section Design: Allows sequential bonding of up to 10 COF units per LCD panel on one side.

Key Specifications

  • Platform Size: 2700 mm (W) × 1500 mm (D).
  • Display Compatibility:
    • Max: 120″ (2700×1500 mm).
    • Min: 25″ (550×320 mm).
    • Thickness: 0.1–1 mm.
  • COF Dimensions: 12–60 mm (L×W); Thickness: 0.1–1 mm.
  • Production Capacity: 70–120 COF units/hour (excluding manual alignment time).
  • Bonding Time: ≤10 seconds per unit.

Technical Features

  1. Precision Bonding System:
    • Main Press Head:
      • Material: Tungsten steel.
      • Surface Flatness: ±5 μm/100 mm.
      • Temperature Range: RT–400°C (constant-temperature heating).
      • Pressure Control: 35–400 N (±5 N precision).
    • Backup Plate: Quartz strip (standard: 120×7×20 mm; customizable).
  2. Adjustable Platforms:
    • LCD Platform:
      • X/Y-axis driven by servo motors + linear guides.
      • Z-axis adjustment: ±3 mm via servo motor.
      • Vacuum fixation (1 mm holes, 1.5 mm grooves).
    • COF Platform:
      • Manual X/Y/Q/Z-axis adjustment (±5 mm for X/Y/Q; ±2 mm for Z).
      • Hard-anodized aluminum material.
  3. Imaging System:
    • 2× 300K-pixel CCD cameras with coaxial LED lighting.
    • Field of View: 3.2×2.4 mm.
    • Lens Spacing: 5–90 mm (adjustable).

Performance Metrics

  • Alignment Accuracy: ±55 μm (X/Y-axis; excludes human/material errors).
    • Minimum Pitch Support: ≥80 μm.
  • Platform Repeatability: ≤0.01 mm.
  • Model Changeover Time: ≤60 minutes (new product); ≤30 minutes (existing product).

Operational Environment

  • Power Supply: Single-phase AC 220V, 50/60 Hz, 3500W.
  • Air Supply: 0.5–0.7 MPa, 480 L/min (φ8 mm tubing).
  • Vacuum: Self-generated; ≥-60 kPa.
  • Conditions: Cleanroom (22–27°C, 40–70% humidity).

After-Sales Support

  • Warranty: 1 year (excludes wear parts and human-induced damage).
  • Training: 1-day on-site program covering operation, calibration, and troubleshooting.
  • Service: 72-hour on-site response for warranty-period issues.

Target Applications

Ideal for manufacturers of ultra-large LCD/OLED panels, including:

  • Television displays (85–120 inches).
  • Digital signage and industrial monitors.
  • Automotive infotainment systems.

SEO Keywords

OLB bonder,COF bonder,COF bonding machine, OL-OLB120-T, single-side OLB bonder, 120-inch display equipment, semi-automatic heat press, COF bonding machine, thermocompression bonding system, large-format display assembler, Olian Automaic, FOG bonding solution, high-precision alignment bonder, flat panel display equipment, manual thermocompression bonder, display module assembly, glass-to-film bonding, industrial display machinery, China automation equipment, reliable OLB bonder, cleanroom-compatible bonder, high-yield display manufacturing, display production line, OLB bonding machine, precision display assembler.

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