The OL-PB3000 Automatic FOB Bonder, manufactured by Shenzhen Olian Automatic Equipment Co., Ltd., is a cutting-edge device designed for the automatic PCB loading, ACF (Anisotropic Conductive Film) attachment, alignment, and thermal compression between FOG (Flexible On Glass) products and PCB (Printed Circuit Board) in LCD products ranging from 5.5″ to 17.3″. This equipment is compatible with single-edge multi-segment FPC (Flexible Printed Circuit) products and can be integrated with other machines from the same company to form a production line.
Automatic FOB Bonder OL-PB3000Device Structure and Workflow
The device consists of several key components, including PCB loading, FOG loading, pre bonding and main bonding platform, detection platform, and an download system. Its workflow starts with PCB loading, followed by FOG loading. Then, the PCB undergoes plasma cleaning. Subsequently, the FOG is transferred to the pre bonding -main bonding platform, and the PCB is also moved to this platform. After alignment between FOG and PCB, the main bonding process takes place. after bonded, the product undergoes various detection processes. If any deviation is detected, the product is discharged through a belt. If the product passes the detection, it is handed over to the subsequent machine or outfeed.
Applicable Product Specifications
The OL-PB3000 accommodates LCD dimensions from 100mm×100mm to 380mm×380mm. The FPC & COF (Chip On Film) dimensions range from 20mm×20mm to 80mm×80mm, with a maximum of 6 FPC & COF units on a single edge and a center distance of≥60mm. The PCB length can be 70 – 380mm, width 10 – 60mm, with a maximum of 1 PCB. The maximum finished product size is 480mm. The ACF can be of the reel type, with 2 or 3 layers. The ACF attachment length is 5 – 80mm, and the width is 0.3 – 5mm, adjustable for different widths. The ACF reel has an inner diameter of 18mm or 25mm, and the maximum reel diameter is 200mm.
Machine Performance Indicators
The OL-PB3000 boasts high-precision production capabilities. The ACF attachment accuracy is X:±0.15mm, Y:±0.1mm. The FOB main bonding accuracy is X: ±25um, Y:±30um. The production cycle is≤10sec/pcs, with the ACF setting time≤0.5sec and the main bonding setting time≤10sec. It is suitable for FOB bonding of single-edge 1 – 6 FPC products. When switching to a new model, the time required is≤90min, and for existing models, it’s≤50min, depending on the engineer’s proficiency.
Process Parameter Specifications
The temperature control for ACF-bonding ranges from RT (Room Temperature) to 120℃, and for main-bonding, it’s RT to 400℃. The heating method for the pressing head is constant heat, with temperature control via PID (Proportional Integral Derivative) control and touch screen settings. The temperature error on the bonding head surface is±5℃, using K-type thermocouples. The time setting for ACF-bonding is 0.1 – 9.9Sec, and for main-bonding, it’s 0.1 – 99.9Sec. The pressure regulation range for ACF-bonding is 10 – 150N, and for main-bonding, it’s 20 – 600N. Pressure regulation for ACF is via a precision pressure regulator, while for main bonding, it’s controlled by a proportional valve and touch screen adjustments.
Overall Machine Specifications
The machine dimensions are approximately 4400mm (length) ×2000mm (width) ×1900mm (height), with a working height of 1000mm. It weighs around 3000KG and comes in ivory white. It requires a cleanroom environment of class 1000 or below. The power supply is three-phase 380V. The machine has a maximum power of 15KW. The air source requirement is a clean compressed air of≥0.5 – 0.7MPa, with a consumption of≈200L/min. The machine is equipped with a vacuum pump (200L/min) and a storage tank. It also features an exhaust system with a centralized silencer. For safety, it has an emergency stop button with a protective cover, interlocking design, and alarm systems.
Automatic FOB Bonder OL-PB3000 Equipment Unit Specifications
The PCB loading section uses tray loading with a tray size range of 400x500mm (max) and 250x250mm (min), and a maximum stack height of 400mm.
The FOG loading can be via belt, platform, or upstream machine integration, with offline unloading. The downloading section can directly connect with downstream machines.
The FOG mechanical hands are equipped with vacuum groups and quantity selectable according to product dimensions, with vacuum value digital displays. The X-axis is driven by linear motor, θ-axis by servo + harmonic reducer, and Z-axis by slide cylinder lifting. The ACF unit features automatic semi-cutting, with cutting depth adjustable via a micrometer.
The ACF stage includes platform vacuum, material, and flatness specifications. The ACF detection part uses a CCD vision system.
The pre-main bonding unit has 4 bonding heads per group, driven by servo + cylinder + guide rail. The pre-main bonding stage involves Y1-axis, X-axis, Y2-axis, FOG-Z-axis, and PCB-Z-axis movements, all driven by servo motors.
The pre-main bonding alignment CCD uses linear motor + guide rail for X-axis movement. The main bonding backup part has specific material, size, and surface flatness requirements.
The buffer material supply part involves step motor-driven rotation, manual width adjustment, and sensor detection for material exhaustion.
Automatic FOB Bonder OL-PB3000 Image Processing and Control Unit
The image processing unit employs the Boshi system with multiple CCD cameras, same-axis light barrels, and different magnifications and field of views for various detection parts. The control unit uses PLC control with a touch screen interface supporting manual and automatic modes. It displays working parameters and can store data for 100 varieties. It also has emergency stop buttons, power switches, lighting switches, door interlock functions, and a three-color operation indicator light.
File Documentation and After-sales Service
The company provides an operation manual and offers training on equipment installation, operation, calibration, parameter setting, maintenance, and troubleshooting. It also includes one year of free after-sales service (excluding damages caused by human error) and lifelong technical support.
Major Component Brands
The Automatic FOB Bonder OL-PB3000 utilizes high-quality components from renowned brands, such as Servo Motors: RETEC (China),Linear Guides: HIWIN/THK (Japan), DD Motors: JAKOB (Singapore), Pneumatic Elements: SMC/AIRTAC (Japan/China), PLC from Keyence, Touchscreens: Weinview (China), sensors from Meiji, switch power supplies from Mingwei, circuit breakers and contactors from Schneider , and drag chains from igus.
In summary, the Automatic FOB Bonder OL-PB3000 is a high-precision, efficient, and reliable device designed to meet the stringent requirements of LCD product manufacturing. With its advanced technology, robust performance, and comprehensive after-sales service, it is an ideal choice for businesses in the electronics manufacturing industry seeking to enhance production efficiency and product quality.
Full Automatic Double sides Double FPCs FOG bonding line
About Olian
Shenzhen Olian Automatic Equipment Co., Ltd. was established in 2012. It is a high-tech enterprise that specializes in the automation equipment for FPD flat panel display and new flexible screen display fields. The company integrates research and development, sales, production, and service. It has multiple invention patents, utility model patents, and software copyrights. Currently, the company has a professional R&D team of over 80 people, as well as production management, quality management, and after-sales service teams.
The company has a precision CNC machining center (precision CNC, large water grinding, lathe, milling machine, grinding machine) and a precision testing center (several production and testing equipment such as imported Japanese two-dimensional and Olympus differential interference microscope), with a total area of 4000 square meters. It has the overall manufacturing and inspection service capabilities from product design to production and processing.
Since its establishment, the company has been committed to creating value for customers, with the spirit of craftsmanship, continuous innovation, and good reputation. With the service spirit of efficiency and customer supremacy, it has been deeply involved in the professional field for more than ten years and has won the respect of customers. It has also become the preferred one-stop solution equipment manufacturer in the minds of customers. Olian people work together with upstream and downstream partners to contribute to the progress of the entire industry and strive to become a leading benchmark enterprise in the display industry.
The company’s products include LCM module factories and full-process (bonding, AOI, dispensing, backlight, soldering) process equipment, realizing the production and manufacturing of display & touch integrated products. The company’s series of products are widely used in display fields such as mobile phones, electronic labels, tablets, smart wearables, automotive displays, computers, and televisions, and provide overall solutions for smart factories.
At present, the company has established long-term and friendly cooperative relations with many excellent and well-known enterprises. Through continuous efforts, the company’s products are sold well in more than 20 provinces and cities in China, as well as Taiwan, Canada, South Korea, Singapore, India, Vietnam, and other countries.
About Full Automatic Double sides Double FPCs FOG bonding line
Overall Wiring Introduction
Introduction to Whole Line Equipment 2.1 Sensor Feeder 2.2 Full Automatic FOG (Positive Bonding) Specification 2.3 Full Automatic FOG (Negative Bonding) Specification 2.4 FPC Feeder 2.5 Sensor Unloader
Introduction to Olian Company’s Advantages
1-1. Overall Wiring Introduction
Overview: Sensor size: 95160-220385mm (7-17 inches), Full Automatic FOG bonding line for Double-sides FPC on Sensor.
1-2. Introduction to Bonding Section
Overview: Full Automatic Double sides Double FPCs FOG bonding line
2.1.1 Introduction to Feeder
Functional Description: The equipment is designed to place the full Tary product in the product feeding warehouse through a mechanical hand, and then place the single product on the downstream equipment receiving platform.
2.1.2 Process Flow
The process flow of the feeder equipment is described.
2.1.3 Equipment Layout
The layout of the feeder equipment is shown.
2.1.4 Functional Description of Equipment Modules
The functional description of each module of the feeder equipment is provided.
2.2.1 FOG (Positive and Negative Bonding) Equipment Appearance
Preliminary design dimensions: <L4970W1350H1800mm (H does not include tricolor lights and FFU), flow direction: left to right, Pass Line: 1000±20mm.
2.2.2 Process Flow
The process flow of the FOG bonding equipment is described.
2.2.3 Details of Separation and Positioning
The details of the separation and positioning process in the FOG bonding equipment are provided.
2.2.4 Layout of Equipment Modules
The layout of the modules in the FOG bonding equipment is shown.
2.3.1 FPC Feeder Specification
FPC size: Max: 8020mm, MIN: 10120mm, Tray size: 460x400mm (MAX), 250x220mm (MIN), process cycle: 4.5S, correction method: visual correction, image processing system: Beijing Boshi, power supply: 220V/50HZ/4KW, main air source: 0.5~0.7Mpa, air consumption: 20L/min, equipment dimensions: 1110(L)×1100(W)×2000(H) (excluding tricolor lights), equipment weight: ≈500Kg.
2.3.2 FPC Feeder Equipment Appearance and Workflow
The appearance and workflow of the FPC feeder equipment are shown.
2.3.3 Equipment Layout
The layout of the FPC feeder equipment is shown.
2.4.1 Introduction to Unloader
Functional Description: The equipment is designed to place the empty Tary in the upper warehouse, and the move mechanical hand absorbs the empty Tary and moves it to the lower warehouse. The mechanical hand then absorbs a single product and places it on the empty Tary until it is full.
2.4.2 Process Flow
The process flow of the unloader equipment is described.
2.4.3 Equipment Layout
The layout of the unloader equipment is shown.
2.4.4 Functional Description of Equipment Modules
The functional description of each module of the unloader equipment is provided.
Advantages of Choosing Olian
VIP After-sales Service Guarantee
Customer first, respond within 30 minutes, 24H service.
Free quality assurance for one year, free on-site after-sales service, installation and debugging, and personnel training, lifelong service.
R&D design and after-sales personnel have more than 8 years of experience, and more than 200 fully automatic line bodies have been produced.
If there is a problem with the equipment quality that cannot be solved within 30 days, it will be replaced or returned for free.
Ensure the agreed delivery time of the machine and smooth production.
1+1+1 VIP service package to ensure timely and fast, one-to-one process.
After the warranty, an annual insurance agreement can be signed to ensure that the after-sales salary cost is charged, and the material model is universal and can be replaced. The price is based on the market purchase price.
Product Quality Assurance System
Strictly follow the technical specifications and standards of customers.
Material quality assurance (supplier quality and delivery guarantee system, signing an agreement with the core supplier of the brand, component technical quality inspection standards, ESD static protection specifications).
Process quality assurance (strictly follow the requirements of assembly operation sequence, machine operation assembly requirements, electrical operation assembly requirements, precision calibration operation requirements,machines debugging operation requirements).
Product final inspection guarantee (strictly follow the customer’s machiens acceptance standards, outgoing packaging and transportation requirements).
Outgoing report (make different requirements for mechanical, electrical assembly operation records, precision inspection records, debugging inspection records, abnormal problem closing records,machines acceptance records according to customer needs
Enterprise Qualifications
The company upholds the principle of “customer first, creating value for customers”, and puts the needs of users first. It always adheres to continuous innovation and continuous breakthroughs, always maintains the industry’s leading position in product, technology, and service, and does a good job in product development and user extreme experience with the spirit of craftsmanship.
Mobile Phone LCD OLED Display Modules bonding machines.The bonding section in mobile phone display module manufacturing is a critical process that ensures reliable electrical connections between flexible printed circuits (FPCs), chips (COG/COF), and display panels (FOG/FOB). This stage demands ultra-precision machinery to achieve sub-micron alignment and thermal stability, with Shenzhen Olian emerging as a leader in providing cutting-edge solutions. Below is an in-depth analysis of the core equipment, technical innovations, and market applications, highlighted by Olian’s state-of-the-art bonding systems.
1. Core Processes & Equipment in Bonding Section Manufacturing
A. Substrate Cleaning & Surface Preparation
EC Cleaning Machines:
Function: Remove particles (<0.1μm) and organic residues from glass/film substrates using ultrasonic waves and deionized water.
Olian’s Innovation: The OL-EC series integrates plasma cleaning for OLED panels, enhancing adhesion by 30% through surface activation .
B. ACF (Anisotropic Conductive Film) Attachment
ACF Bonding Machines:
Process: Apply ACF tape to FPCs or glass substrates using heated rollers (e.g., 80–120°C) and controlled pressure (0.2–0.5 MPa).
Olian’s Solution: The OL-A003 supports 1–7″ panels with ±0.015 mm alignment accuracy, using Panasonic PLC for real-time temperature monitoring .
C. COG/COF Bonding
COG (Chip on Glass) Bonding:
Technology: Thermocompression bonding of IC chips to glass using pulse heating (e.g., 180–250°C) and vacuum alignment.
Olian’s Machinery: The OL-C003 series achieves 12,000 PPI compatibility for microLEDs, with dual servo-driven stages for multi-chip bonding .
COF (Chip on Film) Bonding:
Process: Attach COF to FPCs using ACF or solder paste, with precision alignment via high-resolution CCD cameras.
Olian’s Breakthrough: The OL-COF 156 supports 7–17″ panels, integrating AI-driven defect prediction to reduce rework rates by 50% .
D. FOG/FOB Bonding
FOG (Film on Glass) Bonding:
Function: Bond FPCs to glass panels using ACF, critical for foldable screens.
Olian’s System: The OL-F003 servo-driven fog bonder achieves R3 radius folding stress testing, simulating 200,000+ cycles .
FOB (Film on Board) Bonding:
Application: Connect FPCs to PCBs for automotive displays.
Olian’s Offering: The OL-FOB 156 uses laser alignment (±0.01 mm) and nitrogen-protected bonding to prevent oxidation .
E. Quality Control & Testing
AOI (Automated Optical Inspection):
Technology: AI-powered systems (e.g., KLA-Tencor) detect micro-defects (2–5μm) in bonding lines.
Olian’s Integration: The OL-AOI series combines 3D vision and machine learning to classify defects in real time, achieving 99.8% accuracy .
Burn-In Testing:
Process: Stress-test panels at 100% brightness for 24 hours to validate uniformity.
Olian’s Approach: Customizable burn-in systems with variable voltage/current control for OLED panels.
Multi-IC/FPC bonding with ±0.01 mm precision, supporting 4K resolution panels
Enables cost-effective mid-sized display production
AOI Intelligent Detection Machine
AI-driven defect classification (e.g., misalignment, voids) using 10,000+ parameters/sec
Improves yield by 15%
Innovative Technologies
Roll-to-Roll (R2R) Bonding: Olian’s R2R systems handle flexible polyimide substrates for foldable screens, achieving 200,000+ bend cycles at R3 radii .
EUV Lithography Integration: Collaborations with ASML enable microLED bonding with 12,000 PPI, reducing production costs by 30% .
Sustainability: Water-based ACF materials cut VOC emissions by 60%, aligning with EU RoHS standards .
3. Market Applications & Case Studies
A. Consumer Electronics
Smartphones: Olian’s OL-COG 156 is used in Samsung’s 18.1″ foldable OLED screens, ensuring seamless folding with zero crease .
Wearables: The OL-FOG 003 supports Apple Watch’s curved OLED displays, achieving 3000:1 contrast ratios.
B. Automotive Displays
HUDs: Olian’s OL-FOB 156 bonds FPCs to PCBs for Panasonic’s transparent OLEDs (50% transparency), used in next-gen AR dashboards .
In-Car Panels: Bonding solutions for Tesla’s 17″ touchscreens, ensuring reliability under extreme temperatures (-40°C to 85°C).
C. Industrial & Medical Devices
Medical Monitors: Olian’s OL-AOI series inspects high-resolution LCDs for surgical equipment, meeting ISO 13485 standards.
Industrial Control: Bonding lines for Schneider Electric’s HMI panels, supporting 24/7 operation in harsh environments.
4. Industry Trends & Future Outlook
AI-Driven Automation:
Olian’s AI Bonding Optimizer uses machine learning to predict defects and adjust parameters in real time, reducing downtime by 40% .
Sustainability:
Water-Based ACF Materials: Olian’s eco-friendly solutions cut material waste by 50% compared to traditional thermal bonding .
MicroLED Adoption:
Olian’s EUV lithography-compatible bonding machines enable cost-effective microLED production for AR/VR headsets .
China’s Dominance:
With 45% global OLED panel market share, BOE and Tianma rely on Olian’s equipment for high-yield production .
5. Conclusion
Mobile Phone LCD OLED Display Modules bonding machines.Shenzhen Olian’s bonding section equipment exemplifies the fusion of precision engineering and AI-driven innovation, addressing the evolving demands of flexible displays, microLEDs, and sustainability. By integrating R2R systems, AI quality control, and eco-friendly materials, Olian is reshaping the global display manufacturing landscape. As the industry transitions to 8K/10K resolution and foldable form factors, Olian’s solutions will remain pivotal in ensuring reliability and cost efficiency.
FPC Bonder, also known as a Flexible Printed Circuit Bonder or Flex Cable Bonding Machine, is a crucial device in the electronics manufacturing industry. Shenzhen Olian, a renowned name in the field, designs and manufactures a wide range of high – quality FPC Bonders. These bonders can be classified into different types based on their operation mode, heating technology, and more.
1. Working Principle
The FPC Bonder functions by pressing the FPC (Flexible Printed Circuit) onto various substrates such as glass, PCB (Printed Circuit Board), or another FPC. This is achieved using ACF (Anisotropic Conductive Film) conductive adhesive as a medium. The process involves applying a specific temperature, pressure, and time. For example, when bonding an FPC to a glass substrate in the LCD manufacturing process, the ACF, which contains conductive particles, is placed between the FPC and the glass. Under the action of heat and pressure from the FPC Bonder, the adhesive softens, and the conductive particles are pressed to form electrical connections between the FPC and the glass, while the non – conductive matrix of the ACF provides insulation.
2. Applications
FPC Bonders are widely used in numerous industries. In the LCD/LED/OLED manufacturing sector, they are essential for attaching FPCs to panels in products like mobile phones, TVs, watches, pads, notebooks, touch panels, and ad players. In mobile phone production, for instance, FPC Bonders ensure the reliable connection of FPCs that carry signals between different components such as the display, motherboard, and camera module. They are also used in the repair services of these products. Additionally, in industries such as bank card manufacturing (where FPCs are used for contactless payment functions), zebra paper applications, and camera production, Shenzhen Olian’s FPC Bonders play a vital role.
3. Types of FPC Bonders by Shenzhen Olian
3.1 By Heating Technology
3.1.1 Pulse Heating Bonder
This type of FPC Bonder from Shenzhen Olian, such as the OL – FP003，OL-FP005, OL-FDP006,OL-FP006 model, uses pulse heating technology. It provides rapid heating and cooling cycles. Pulse heating is beneficial when dealing with sensitive components or materials that require precise temperature control. The heating element in the pulse heating bonder delivers short, high – energy pulses of heat, which can quickly reach the required bonding temperature. This not only reduces the overall heating time but also minimizes the risk of overheating adjacent components.
3.1.2 Constant Temperature Bonder
The constant temperature FPC bonder, like some models OL-FD006,OL-F003,OL-F006,OL-FOG156,OL-FOB156, in Shenzhen Olian’s product line, maintains a stable and continuous temperature during the bonding process. This is suitable for applications where a consistent temperature environment is crucial for achieving high – quality bonds. For example, when bonding FPCs to substrates with materials that have specific temperature – sensitive characteristics, a constant temperature bonder can ensure that the temperature remains within the optimal range throughout the bonding operation.
3.2 By Operation Mode
3.2.1 Semi – automatic FPC Bonder
15.6Inch FOB bonding machine
Shenzhen Olian’s semi – automatic FPC Bonders, such as certain entry – level models, require some manual intervention during the bonding process.
Operators are responsible for tasks like manually loading the FPC and substrate onto the machine’s platform.
Once the components are in place, the machine takes over and applies the pre – set temperature, pressure, and time parameters for the bonding operation.
These bonders are an excellent choice for small – to – medium – sized production batches or for manufacturers with a more hands – on approach.
They are cost – effective and can be easily operated by technicians with basic training.
For instance, in a small – scale electronics repair shop that needs to bond FPCs in a limited number of devices daily, a semi – automatic FPC Bonder provides the flexibility to handle different repair jobs while keeping costs down. Technically, they may have a slightly lower production capacity compared to their fully automatic counterparts but still offer high – precision bonding.
They often come with adjustable platforms to accommodate different – sized FPCs and substrates, and the temperature and pressure settings can be customized according to the specific bonding requirements.
The automatic FPC Bonders from Shenzhen Olian, on the other hand, offer a high – level of automation. These machines are equipped with advanced robotic arms or conveyor systems that can automatically load, position, and bond the FPCs to the substrates.
They are ideal for large – scale production lines where high – volume and high – speed bonding are required.
For example, in a large – scale mobile phone manufacturing factory that produces thousands of devices per day, an automatic FPC Bonder can significantly increase production efficiency.
They are integrated with sophisticated vision – based alignment systems, such as the down/up contraposition HD colorful CCD and large – sized HD LCD screens for visual inspection. This ensures that the FPCs are precisely aligned with the substrates before bonding, resulting in a higher yield rate.
Automatic FPC Bonders also often feature advanced control systems, such as the Panasonic PLC control system, which enables seamless operation and easy programming of different bonding processes. They can handle a wide range of FPC and substrate sizes, from small – sized components in wearable devices to larger – sized ones in tablets and laptops.
3.3 By Applications:
FPC Bonder can be classified based on their specific applications and the type of bonding process they perform:
FOG (Flex-On-Glass) Bonder
Description: FOG bonders are used to bond FPCs directly onto glass substrates, commonly found in LCD and OLED displays. These machines offer high bonding accuracy and are essential for maintaining the quality and performance of display panels.
Features:
High bonding accuracy (XY: ±10µm) for all panel sizes.
Enhanced alignment accuracy using the same camera view to recognize marks on FPC and the LCD panel.
Improved stability through a rigid frame and new control methods for bonding load and speed.
Applications: Widely used in the production of small to medium-sized display panels, such as those found in smartphones and tablets.
FOB (Flex-On-Board) Bonder
Description: FOB bonders are designed to bond FPCs onto printed circuit boards (PCBs). They are crucial for connecting flexible circuits to rigid boards, ensuring a reliable electrical connection.
Features:
High throughput, capable of transferring up to 4 panels at once for panels smaller than 8 inches.
Reduced model changeover time, as no stage replacement is required for panel size and ACF width changes.
Double-stage IC supply to eliminate line stops.
Applications: Commonly used in the assembly of electronic devices where FPCs need to be connected to PCBs, such as in automotive electronics and industrial control panels.
FOF (Flex-On-Flex) Bonder
Description: FOF bonders are used to bond FPCs onto other FPCs, creating a flexible-to-flexible connection. This is particularly useful in applications where space is limited and flexibility is required.
Features:
High precision and reliability in bonding flexible-to-flexible connections.
Suitable for a wide range of FPC sizes and configurations.
Applications: Used in wearable technology, foldable devices, and other applications where flexibility and compact design are crucial.
T-FOG (Touch Flex-On-Glass) Bonder
Description: T-FOG bonders are a variant of FOG machines that touch panel FPCs onto glass substrates. This process is particularly useful for applications where additional support or protection is required.
Features:
Enhanced bonding strength and durability.
Suitable for high-resolution displays and applications requiring high reliability.
Applications: Commonly used in high-end display manufacturing, such as OLED and micro-LED displays.
FOP (Flexible Printed Circuit on Plastic) Bonder
Description: FOP bonders are general-purpose machines used for bonding FPCs to Plastic, They offer a wide range of bonding options and are highly versatile.
Features:
High bonding accuracy and precision.
Support for various bonding materials, including ACF and solder paste.
Suitable for a wide range of panel sizes and applications.
Applications: Used in the production of a variety of electronic devices, from consumer electronics to industrial and medical equipment.
4. Technical Specifications
Shenzhen Olian’s FPC Bonders come with impressive technical specifications. Take the upper and down contraposition movable platform FPC bonding machine (models like F003/F006/FP003/FP006/FS003/FS006) as an example:
Suitable for: It is designed for aligning and pressing FPCs to LCD panel glass, PCB, or COF (Chip on Film) which have ACF film attached. It can handle size ranges from 1 to 12 inches.
Attach Precision: The attach precision is as high as ±0.015 mm, ensuring accurate and reliable connections.
Machine Capacity: With a capacity of 6000 pcs/day (at 12 s/pc), it offers high – volume production capabilities.
Power Supply: It operates on a power supply of 220 V ± 10%, 50 Hz, with a power consumption of 1200 W.
Air Supply: Requires an air supply of 0.5 – 0.7 MPa of dry air.
Platform Size and Precision: The platform size is L 90 * W 60 mm, and it has a precision of ±0.01 mm.
Temperature and Time Range: The temperature range is 1 – 350 °C, and the time range is 1 – 99.9 sec, providing flexibility for different bonding requirements.
Product Size and Weight: The machine has dimensions of W 850 * D 800 * H 1460 mm and a net weight of about 200-500 kg.
These FPC Bonders are also equipped with advanced features such as a constant temperature heating system or a pulse heating system, Panasonic PLC control system for precise operation control, a human – machine interface for easy operation, automatic temperature alarm to prevent overheating, a press head level adjustable device for accurate pressure application, down/up contraposition HD colorful CCD and 10.4 – 24 inch HD LCD for visual inspection during the bonding process, and manual/automatic switching options. They also have imported electrical configurations, making them suitable for all LCD, LED, on – cell, and OLED panels.
Key Features and Specifications
High Precision: Offers high bonding accuracy, typically within ±0.015mm, ensuring reliable connections.
Increased Productivity: Automation reduces the time required for each bonding process, allowing for higher production rates.
Reduced Labor Costs: By minimizing manual operations, the machine reduces labor costs and the risk of human error.
Enhanced Reliability: The consistent bonding process ensures that each product meets high-quality standards, reducing the likelihood of defects.
Real-Time Monitoring: Advanced sensors detect bonding quality in real time, allowing for immediate error detection and minimizing waste and rework.
High-Speed Automation: Designed for high-speed production, increasing throughput while maintaining accuracy.
Applications of FPC Bonders
FPC Bonders are indispensable across diverse industries:
Consumer Electronics: Commonly used in the manufacturing of smartphones, tablets, and other devices that require flexible and durable displays.
Automotive Displays: Used in the production of vehicle displays, where flexibility and durability are critical.
Medical Devices: High-precision bonding for diagnostic equipment screens.
Industrial Equipment: Applied in control panels and ruggedized display solutions.
Foldable and Wearable Tech: Facilitates bonding for next-gen foldable devices and flexible wearables.
In conclusion, Shenzhen Olian’s FPC Bonder are highly reliable and efficient devices that meet the diverse needs of the electronics manufacturing and repair industries. Their advanced features and excellent technical specifications make them a preferred choice for companies looking to ensure high – quality FPC bonding operations.
5-17 Display Module fully Automatic COG FOG Bonder: LOAD/EC/COG/FOG/FPC Feeding System
Introduction
5-17 Display Module fully Automatic COG FOG Bonder for the production of mid-size display modules (5-17.3 inches), focusing on the integration of various equipment for high-precision and high-efficiency manufacturing. The solution includes panel loading, terminal cleaning, COG (Chip on Glass) and FOG (FPC on Glass) bonding, as well as FPC (Flexible Printed Circuit) feeding. Each component is designed to work seamlessly with others to ensure smooth production flow and superior product quality.
Equipment Overview
1. Panel Loading Machine (OL-LLD3000)
Panel Size Range: 5″ to 17.3″ (MIN: 80×80 mm, MAX: 380×380 mm)
Thickness: 0.15–0.7 mm
Tack Time: ≤4 seconds for 7″ panels (non-stop loading)
Vacuum & Air Supply: Compatible with customer-provided vacuum or standalone pump
Tack Time: ≤4 seconds for same FPC, ≤6 seconds for dual FPCs
Precision: ±0.03mm
Power: Single-phase, 220V, 3.5KW
Dimensions: ~1100(L) × 1450(W) × 1900(H) mm
Process Flow
Panel Loading: Panels are loaded automatically with precise handling.
Terminal Cleaning: Terminals are cleaned using IPA and plasma to ensure contamination-free surfaces.
ACF Application: ACF material is applied precisely onto the glass or FPC.
IC/FPC Bonding: ICs or FPCs are aligned and bonded onto the glass using COG or FOG processes.
AOI Inspection: Products undergo automated optical inspection to ensure quality.
Key Features
High Precision: Ensures accurate alignment and bonding for superior product quality.
Automation: Reduces manual intervention, minimizing errors and improving efficiency.
Versatility: Compatible with various panel sizes and FPC configurations.
Reliability: Robust construction and high-quality components ensure consistent performance.
Conclusion
5-17 Display Module fully Automatic COG FOG Bonder for mid-size display modules offers a comprehensive approach to efficient and precise manufacturing. By integrating advanced technologies and equipment, it ensures high yield, superior quality, and cost-effectiveness, making it ideal for modern display production environments.
Fully Automatic FOB Bonder for 5-17inch Displays provides a manufacturing, precision, speed, and reliability platform for FPC-PCB bonding.
Overview
The Fully Automatic FOB (FPC on Board) Bonder is a sophisticated solution designed for the high-precision bonding of multiple FPCs (Flexible Printed Circuits) onto PCBs (Printed Circuit Boards) for mid-size Liquid Crystal Module (LCM) displays ranging from 5 to 17.3 inches. This solution integrates advanced technologies such as automated ACF (Anisotropic Conductive Film) application, high-precision imaging systems, and robotic handling to ensure superior product quality and production efficiency.
Key Features
High-Precision Bonding: Achieves bonding accuracy of X±20um and Y±40um.
Automated ACF Application: Ensures precise ACF application with X±0.20mm and Y±0.10mm accuracy.
Multiple FPC Support: Capable of bonding up to 6 FPCs of 2 different types.
Fast Production Rate: Achieves a cycle time of ≤7.5 seconds for 5-11″ displays and ≤9.8 seconds for 11-17.3″ displays.
Robust Construction: Features a high-rigidity structure for stability and durability.
Advanced Imaging System: Utilizes high-resolution cameras and Japanese-imported image processors for precise alignment.
Temperature Control: Equipped with a high-precision constant temperature heating system.
Equipment Composition
FOB Host Machine: Core unit for ACF application, alignment, and bonding.
PCB Auto-Loader: Provides continuous PCB supply with non-stop loading capability.
LCD Handling System: Manages LCD movement with precision and care.
ACF Application Unit: Applies ACF material accurately and efficiently.
Pre-bonding and Main bonding Units: Ensures reliable bonding through precise pressure application.
AOI+ART Inspection System: Detects defects and ensures quality.
Technical Specifications
LCD Dimensions: 5″ to 17.3″ (MIN: 100×80mm, MAX: 403×293mm).
FPC Dimensions: MIN: 10×10mm, MAX: 85×50mm.
PCB Dimensions: MIN: 75×10mm, MAX: 400×100mm.
ACF Parameters: Supports SONY/HITACHI ACF, with widths of 0.6mm to 2.0mm and lengths of 5-157mm.
Environmental Requirements: Operates in Class 1000 cleanroom conditions.
Power Requirements: Three-phase AC380V (±5%), 18KW.
Process Flow
PCB Loading: PCBs are loaded automatically with vision alignment.
ACF Application: ACF is applied precisely onto the PCB.
FPC & PCB Alignment: High-precision imaging systems align FPCs with PCBs.
Pre-bodning: pre-bonding is applied to position components accurately.
Main bonding: Final bonding is performed with controlled pressure and temperature.
AOI+ART Inspection: Products are inspected for quality and defects.
Safety and Reliability
ESD Protection: Equipped with ionizers and anti-static materials.
Documentation: Detailed operation manuals and troubleshooting guides.
Conclusion
The Fully Automatic FOB Bonder for 5-17inch Displays is a cutting-edge solution for mid-size display manufacturing, combining precision, speed, and reliability. It is designed to meet the demands of modern display production, ensuring high yield and product quality. Whether for consumer electronics or industrial displays, this solution provides a robust platform for efficient FPC-PCB bonding.
Olian is a national high-tech enterprise specializing in automation solutions for Liquid Crystal Module (LCM) manufacturing. Our 3000 series mid-size (5-17.3″) LCM module automation solution is designed to streamline the production process for mid-size displays, offering high precision, efficiency, and reliability. Below is a detailed introduction to the key components and features of this solution.
1. Overall Wiring Introduction
The 3000 series solution is tailored for mid-size displays (5″ to 17.3″) requiring multi-IC (1-2 types) and multi-FPC (1-2 types) configurations. The system integrates high-speed, fully automated equipment for LOAD/EC/COG/FOG/FPC processes, ensuring precision and efficiency in display module assembly.
Key Features:
End Cleaning: Utilizes alcohol and plasma cleaning for terminal surfaces.
Fully Automated COG/FOG Bonding: Equipped with ACF (Anisotropic Conductive Film) application, pre-press, and main press functionalities.
Panel and FPC Loading: Supports single or dual FPC loading with high-speed handling.
Process Flow:
Manual Loading: Full trays are loaded manually.
Mechanical Handling: Single products are picked by robotic arms.
EC Cleaning: IPA (isopropyl alcohol) and plasma cleaning for terminals.
ACF attachingApplication: Precision application of ACF material.
Pre-bonding and Main bonding: Alignment and bonding of ICs/FPCs.
CCD AOI Inspection: Vision correction and defect detection.
2. Bonding Segment Equipment Introduction
The bonding segment consists of specialized equipment for panel loading, terminal cleaning, COG/FOG bonding, and FPC loading. Each component is designed to ensure high precision and reliability.
2.1 Panel Loading Machine (OL-LLD3000)
Panel Size Range: 5″ to 17.3″ (MIN: 80×80 mm, MAX: 380×380 mm).
Thickness: 0.15–0.7 mm.
Tack Time: ≤4 seconds for 7″ panels (non-stop loading).
Vacuum & Air Supply: Compatible with customer-provided vacuum or standalone pump.
Mid-Size 5-17.3″ LCM Module Manufacturing Solution from Shenzhen Olian Automatic Equipment Co., Ltd. is a comprehensive, high-precision system designed to meet the demands of modern display manufacturing. By integrating advanced technologies such as plasma cleaning, ACF bonding, and automated handling, this solution ensures efficiency, reliability, and superior product quality. Whether for COG, FOG, or FPC applications, the 3000 series provides a robust platform for mid-size display production.
The 7″ standard COG (Chip on Glass) line is a specialized production line for manufacturing liquid crystal displays (LCDs) using the COG technology. This line comprises several key pieces of equipment, each playing a crucial role in the manufacturing process. Below is an introduction to each equipment used in this line:
Glass Feeding Machine (OL-LLD1000)
The Glass Feeding Machine, model OL-LLD1000, is responsible for loading glass substrates onto the production line. It ensures that glass panels are fed into the system accurately and efficiently. This machine is designed to handle glass of specific dimensions and thickness, matching the requirements of the 7″ display production. Its high-precision feeding mechanism guarantees smooth operation and minimizes the risk of glass breakage during the loading process.
FPC Feeding Machine (OL-FLD1000)
The FPC (Flexible Printed Circuit) Feeding Machine, model OL-FLD1000, loads the flexible circuits that will be bonded onto the glass substrates. It feeds the FPCs into the production line with high accuracy, ensuring proper alignment for subsequent bonding processes. This machine is capable of handling various types of FPCs, accommodating different designs and sizes as required by the production schedule.
EC Cleaning Machine (OL-EC600A)
The EC (Electrode Cleaning) Cleaning Machine, model OL-EC600A, is used to clean the electrodes on the glass substrates. It removes contaminants, dust, and residues that may affect the bonding quality and overall performance of the LCD. This machine employs advanced cleaning technologies, such as plasma cleaning or ultrasonic cleaning, to ensure thorough and gentle cleaning of the electrodes without causing damage to the delicate glass surface.
COG Bonding Machine (OL-CB600A)
The COG Bonding Machine, model OL-CB600A, is the core equipment of the COG line. It performs the critical task of bonding the chip directly onto the glass substrate. This machine achieves precise alignment and bonding with high accuracy, ensuring excellent electrical and mechanical connections between the chip and the glass. It utilizes advanced bonding technologies, such as thermal compression bonding or anisotropic conductive film (ACF) bonding, to produce reliable and high-quality COG assemblies.
FOG Bonding Machine (OL-FB600A)
The FOG (Film on Glass) Bonding Machine, model OL-FB600A, is used for bonding films onto the glass substrates. It is essential for creating the protective layers and additional functional layers required in LCD production. This machine ensures precise positioning and bonding of the films, preventing any bubbles or wrinkles that could affect the display quality. It supports various types of films, including polarizing films and protective films, and can adapt to different production requirements.
Conclusion
The 7″ standard COG line, equipped with these advanced machines, enables efficient and high-quality production of liquid crystal displays. Each equipment works in harmony to ensure precise and reliable manufacturing processes, contributing to the overall performance and reliability of the final LCD products.
7″ Standard COG FOG Line Equipments. include the galss feeding, FPC feeding, EC cleaning,COG bonding,FOG bonding equipments.
The OL-Q004 PLASMA cleaner is designed for efficient surface treatment of glass substrates ranging from 1 to 7 inches. It specializes in cleaning the glass pressing end, preparing surfaces for subsequent bonding processes. As a semi-automatic machine, it integrates human oversight with automated precision. With a processing capacity of 600-800 PCS/H, it ensures thorough cleaning without causing damage to delicate glass surfaces. Its compact design makes it an ideal addition to medium-scale production lines, enhancing cleaning efficiency while saving floor space.
2. ACF Attacher (OL-A003)
ACF laminator
The OL-A003 ACF attacher is tailored for applying Anisotropic Conductive Film (ACF) to glass and IC components. It supports substrates from 1 to 7 inches and can be extended to 12 inches with additional costs. This machine ensures precise and consistent application of ACF tape on glass ends and ICs, which is crucial for reliable electrical connections in electronic assemblies. With a processing capacity of 800-1000 PCS/H, it offers efficient material handling and reduces waste, making it a valuable asset in display and touch panel manufacturing.
3. Semi-automatic COG Pre-bonder (OL-COF003)
semi automatic COG COF COP pre bonding machine
The OL-COF003 COG pre-bonder specializes in the preliminary bonding of ICs in Chip on Glass applications. It supports substrates from 1 to 7 inches and can be extended to 12 inches with additional costs and process limitations. This semi-automatic machine ensures accurate IC pre-bonding with a processing capacity of 600-800 PCS/H. Its user-friendly interface simplifies parameter settings, enabling quick adaptation to different product requirements while maintaining high reliability during production runs.
4. Dual-head Servo Bonder (OL-C012)
COG COF COP main bonding machine
The OL-C012 dual-head servo bonder offers increased productivity through its dual-head design, allowing for simultaneous bonding operations. Each head operates independently with precise servo control, ensuring consistent bonding quality across multiple channels. It supports substrates from 1 to 7 inches and can be extended to 12 inches with additional costs. With a processing capacity of 600-800 PCS/H, it minimizes downtime between cycles and is an excellent choice for manufacturers seeking to maximize output in limited production spaces.
5. Bottom Alignment FOG Thermal Bonder (OL-F003)
FOG/FOF/FOP bonding machine
The OL-F003 FOG thermal bonder is specialized for Film on Glass bonding applications, particularly for glass and liquid crystal alignments. It supports substrates from 1 to 7 inches and can be extended to 12 inches with additional costs. This machine offers precise temperature control to ensure reliable adhesion while preventing thermal damage to sensitive materials. With a processing capacity of 200-300 PCS/H, it improves processing speed and consistency, making it a valuable asset in display and touch panel manufacturing.
6. Top and Bottom Alignment FOG Thermal Bonder (OL-F006)
Manual FOB/FOF/FOP/FOG ACF binding machine
The OL-F006 FOG thermal bonder is designed for Film on Film bonding and touch panel alignments. It supports substrates from 1 to 7 inches and can be extended to 12 inches with additional costs. This machine features advanced alignment systems for both top and bottom substrates, ensuring precise film positioning and reliable bonding. With a processing capacity of 200-300 PCS/H, it offers efficient thermal management and customizable bonding parameters, making it suitable for various FOF and touch panel bonding requirements.
manual ACF bonding machineCOF REPAIR MACHINEFS003 sevo FCOG BonderCOF punching machinesingle head LCD Bonding machineLCD REPAIRNG MACHINE3 heads FPC bonding machineFPC (Flexible Printed Circuit) Bonding Machinepulse heating FOG bonding machineACF bondersingle head pulse heat FOG FOB bonding machineFPC (Flexible Printed Circuit) Bonding MachineSingle head COF bonding machine
In summary, Shenzhen Olian’s Semi-Auto 1-7inch LCD/OLED bonding machines portfolio is designed to meet the specific needs of modern electronic and display manufacturing. Each machine combines advanced technology with user-friendly designs to enhance precision, efficiency, and reliability. Whether for cleaning, ACF attachment, pre-bonding, final bonding, or specialized FOG/FOF processes, our solutions help manufacturers achieve optimal production outcomes in competitive market environments.
The OL-QX156 PLASMA cleaner, developed by Shenzhen Olian, is designed for efficient surface treatment of medium-sized components in electronic and display manufacturing. It utilizes advanced PLASMA technology to remove contaminants and improve surface adhesion properties. The semi-automatic operation ensures a balance between precision and human oversight. Its multi-stage cleaning process allows for thorough and customized cleaning cycles, adapting to different material requirements. The machine’s compact design saves floor space while maintaining high cleaning efficiency, making it ideal for medium-scale production environments.
The OL-COG156 pre-bonder specializes in the preliminary bonding steps for Chip on Glass (COG) and Chip on Film (COF) applications. It features precise alignment systems to ensure accurate component placement before final bonding. The multi-stage process allows for temperature and pressure adjustments at each stage, optimizing the pre-bonding quality. Its user-friendly interface simplifies parameter settings, enabling quick adaptation to different product requirements. The machine’s robust construction ensures reliability during high-volume production runs.
Designed for the application of Anisotropic Conductive Film (ACF), the OL-A00156 ensures precise and consistent attachment of this critical material in electronic assemblies. The multi-stage process allows for accurate film positioning and application of optimal pressure and temperature. The machine’s ability to handle various ACF materials makes it versatile for different manufacturing needs. Its automated feeding system improves material handling efficiency, reducing waste and enhancing overall productivity.
single head COG bonding machineCOG COF main bonder
The OL-CBD156 is a versatile bonder featuring a single moving head that can perform multiple bonding stages with high precision. Its servo-controlled mechanism ensures accurate control of pressure, temperature, and positioning. The moving head design allows for flexible adaptation to different product sizes and configurations. The machine’s advanced control system enables customizable bonding profiles, making it suitable for complex bonding requirements in medium-sized production settings.
5. Dual-head Servo final-Bonder (OL-CB156)
COG main bonder
Offering increased productivity through its dual-head design, the OL-CB156 allows for simultaneous bonding operations. Each head operates independently with precise servo control, ensuring consistent bonding quality across multiple channels. The machine’s efficient material handling system minimizes downtime between cycles. Its compact footprint and high-speed operation make it an excellent choice for manufacturers seeking to maximize output in limited production spaces.
Combining the benefits of dual heads with multi-stage processing, the OL-CBY156 provides exceptional flexibility and efficiency. The moving heads can perform sequential bonding operations at different positions, reducing the need for manual intervention. Its advanced thermal management system ensures consistent bonding temperatures across all stages. The machine’s modular design allows for easy maintenance and upgrades, extending its useful life in demanding manufacturing environments.
7. Medium-sized FOG Thermal Bonder (OL-FOG156)
FOG bonderFOG bonder
Specialized for Film on Glass (FOG) applications, the OL-FOG156 offers optimized thermal bonding capabilities for medium-sized components. Its precise temperature control ensures reliable adhesion while preventing thermal damage to sensitive materials. The machine’s adjustable pressure system accommodates different film and glass combinations. Its automated operation improves processing speed and consistency, making it a valuable asset in display and touch panel manufacturing.
Designed for Film on Board (FOB) bonding processes, the OL-FOB156 provides efficient and reliable thermal attachment of film components to circuit boards. It features accurate alignment systems to ensure proper film positioning on the board. The machine’s thermal profiling capabilities allow for customization based on specific material properties and bonding requirements. Its robust construction and automated features enhance productivity while maintaining high-quality standards in medium-sized production settings.
FOG bonderFOG bonderFOB BonderFOG FOB bonderFOG bonderACF attacher FOG bonderACF attacher COG bonder150mm press head bonding machineCOG pre-bonding and main bonding 2 in 1 machine
In summary, Shenzhen Olian’s range of manufacturing equipment is tailored to address the specific needs of modern electronic and display production. Each machine incorporates advanced technologies and user-friendly designs to enhance precision, efficiency, and reliability. Whether for cleaning, pre-bonding, material attachment, or final bonding processes, our solutions help manufacturers achieve optimal production outcomes in competitive market environments.
Semi Automatic Mid Size Displays Bonding Equipments. EC Cleaner，ACF Attacher， COG pre bonder，COG mian bonder，FOG bonder ，FOB bonder. Welcome you visit us for more details.
