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ACF Particle AOI Machine

Particle AOI Machine

ACF Particle AOI Machine

ACF Particle AOI Machine,OL-3A20A

Particle AOI Machine

Overview:

This is a ACF Particle AOI (Automated Optical Inspection) machine used in the bonding process. It is designed to inspect particles on ICs and FPCs, ensuring high-quality bonding in LCD manufacturing.


1. Technical Parameters

1.1 Glass Specifications

  • Glass Size Range: 1 inch to 7 inches (16:9 aspect ratio)

1.2 Inspection Capabilities

  • Inspection Edge: Single-sided inspection
  • Inspection Area: Bump region
  • IC Size: Length: 5 mm to 64 mm; Width: 0.4 mm to 1.8 mm
  • FPC Size: Bonding area length < 64 mm; Non-bonding side < 120 mm; Inspection area width < 1.8 mm (if > 1.8 mm, multiple scans are required)

1.3 Detection Objects

  • Detection Objects: IC, FPC particle pressure marks
  • IC, FPC Shift: Calculated by the distribution of conductive particles; Shift detection precision: ±1.5 μm
  • IC, FPC Distribution Uniformity: Detected by segmenting the ROI (Region of Interest) and checking the particle count in each segment (up to ten segments)
  • Particle Count Repeatability: ±10%
  • Defect Rate: < 0.05%
  • Pass Rate: < 1%

1.4 Defect Detection

  • Defects Detected: Cracks, chips, foreign objects, dimples, dirt, missing parts, scratches, and corrosion

1.5 Product Positioning

  • Camera Quantity: 1 x 5 million pixel monochrome camera
  • Field of View: 14 mm x 14 mm
  • Pixel Size: 7 μm/pixel

1.6 Product Inspection

  • Camera Quantity: 1 x line scan camera
  • Resolution: 3K
  • Field of View: 1.8 mm wide x scan length
  • Pixel Size: 0.7 μm/pixel
  • Focusing Method: Auto focus

1.7 Power Supply

  • Working Power Supply / Power: 220V (±10%) / 50 Hz / 7.5 kW

1.8 Device Dimensions and Weight

  • Device Dimensions: 1800 mm (L) x 1400 mm (W) x 2100 mm (H)
  • Device Weight: ≈ 2000 kg

2. Product Introduction

The ACF Particle AOI Machine is a high-precision inspection device designed for the bonding process in LCD manufacturing. It is capable of detecting particles on ICs and FPCs, ensuring the quality of the bonding process.

Key Features:

  • High Precision: The machine can detect particles as small as 1.5 μm, ensuring high-quality bonding.
  • Versatility: It supports a wide range of glass sizes (1 inch to 7 inches) and can inspect both ICs and FPCs.
  • Advanced Detection: The machine uses a 5 million pixel monochrome camera and a line scan camera to detect various defects, including cracks, chips, foreign objects, and more.
  • Efficient Production: With a high pass rate and low defect rate, the machine ensures efficient and reliable production.
  • Durable Construction: Built with high-quality materials and components, the machine ensures long-term reliability and performance.

Applications:

Ideal for LCD manufacturing facilities requiring high-precision inspection of particles on ICs and FPCs. The machine is designed to be used in the bonding process, providing a comprehensive solution for quality control.

After-Sales Support:

  • Training: Comprehensive training on equipment installation, operation, maintenance, and troubleshooting.
  • Service: One year of free service (excluding human damage) and lifelong technical support.

The ACF Particle AOI Machine is a cost-effective and efficient solution for modern LCD production, offering advanced technology and reliable performance.

Particle AOI Machine

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