In the ACF (Anisotropic Conductive Film) bonding process, a variety of parts and accessories are used to ensure the quality and reliability of the final products. These components play a crucial role in the production line, from initial material preparation to final product testing. Here is a comprehensive overview of the parts and accessories used in ACF bonding processes:
ACF Tape
ACF Tape is the core material used in the ACF bonding process. It is an epoxy adhesive system filled with conductive particles that provide electrical interconnection between pads through the film thickness (z-direction). The conductive particles are distributed far apart to ensure electrical insulation in the plane direction (X&Y) of the film. ACF tape is available in various models and is specific to the application for which it is designed. For example, ACF designed for flex-on-glass (FOG) assembly is usually not suitable for chip-on-glass (COG) or chip-on-film (COF) applications.
Hot Bar/Thermode
The Hot Bar or Thermode is the primary tool used to apply heat and pressure during the ACF bonding process. Hot bar bonding systems are designed to heat the hot bar to a specific temperature using low voltage electricity, which temperature is fed back to the controller via a thermocouple. The hot bar is brought into contact with the ACF film over the bonding pad, heated to the bonding temperature, and held for a specified time. This process produces the connection between the ACF tape and the components.
Bonding Heads
Bonding Heads are designed to hold the components and position the ACF tape correctly with the conductive pads on the PCB or other components. They ensure that the bonding process is accurate and consistent. Bonding heads can be manual or automated, depending on the specific requirements of the bonding process.
ACF Cutting Machines
ACF Cutting Machines are used to cut the ACF tape to the required length and shape. These machines ensure that the ACF tape is accurately cut and positioned for the bonding process. The cutting is done using the half-cut method, where only the actual ACF material is cut, and the cover-layer is used for tape transport.
ACF Bonding Applications
ACF bonding is widely used in various industries, including mobile phone manufacturing, automotive, LCD production, mobile computers, TV manufacturing, open cell panels, touch panels, smart watches, and pads. It is also used in research labs focusing on LCD/LED/OLED/MICRO LED/MINI LED displays.
Benefits of ACF Bonding
ACF bonding offers several benefits, including:
Lead-free and environmentally friendly
Smallest pitch >30 micron possible
Flux-free process
No cleaning required after the process
Low process temperatures
High reliability and performance
Cost-effective compared to traditional connectors and soldering
In conclusion, the ACF bonding process relies on a suite of sophisticated parts and accessories to ensure the quality and reliability of the final products. Each component plays a critical role in different stages of the production process, from initial material preparation to final product testing. By using these parts and accessories, manufacturers can optimize their processes, reduce defects, and ensure that their products meet the highest standards of quality and performance.
