7-17 Inch Semi-Automatic COG+FOG Bonding Line

7-17 Inch Semi-Automatic COG+FOG Bonding Line

7-17 Inch Semi-Automatic COG+FOG Bonding Line: Efficient and Precise Solution for Display Manufacturing,

Shenzhen Olian offers a comprehensive 7-17 inch semi-automatic bonding line designed to meet the high-precision requirements of display manufacturing. This line integrates multiple processes, including EC cleaning, ACF bonding, COG pre-bonding, COG main-bonding, and FOG bonding, ensuring efficient and reliable production.

Key Components of the 7-17 Inch Semi-Automatic COG+FOG Bonding Line

• EC Cleaner: The line begins with an EC (Electrochemical) Cleaner, which ensures that the surfaces of the components are free from contaminants. This is a crucial step in the bonding process, as it ensures the reliability and quality of the final product. The EC Cleaner uses advanced electrochemical processes to remove impurities, providing a clean and ready surface for bonding.
• ACF Bonder: The ACF (Anisotropic Conductive Film) Bonder is used to attach the ACF tape to the substrates. This machine ensures precise alignment and bonding, which is essential for creating reliable electrical and mechanical connections. The ACF Bonder is designed for high precision and consistency, making it an indispensable part of the bonding line.
• COG Pre-Bonder: The COG (Chip on Glass) Pre-Bonder is used for the initial alignment and attachment of IC chips to the glass substrate. This machine ensures that the components are accurately positioned before the final bonding process. The COG Pre-Bonder is equipped with advanced vision systems for precise alignment, ensuring high-quality bonding.
• COG Main-Bonder: The COG Main-Bonder is responsible for the final bonding process, where the components are pressed together under precise temperature and pressure conditions. This machine ensures strong and reliable connections, crucial for the performance of the display. The COG Main-Bonder is available in both constant heat and pulse heat systems, offering flexibility based on the specific requirements of the bonding process.
• FOG Bonder: The FOG (FPC on Glass) Bonder is used for bonding FPCs (Flexible Printed Circuits) to the glass substrate. This machine supports various bonding processes, including FOG, FOF (FPC on FPC), and FOB (FPC on Board). The FOG Bonder is designed for high precision and efficiency, making it suitable for a wide range of applications.
• FOB Bonder: The FOB (FPC on Board) Bonder is used for bonding FPCs to PCBs (Printed Circuit Boards). This machine ensures reliable and consistent bonding, essential for the performance of electronic devices. The FOB Bonder is equipped with advanced features such as multi-stage temperature control and real-time temperature curve display, ensuring precise bonding.

7-17 Inch Semi-Automatic COG+FOG Bonding Line Advanced Features and Benefits

• High Precision Alignment: The bonding line uses advanced vision systems for precise alignment of components, ensuring accurate bonding every time. This feature is crucial for maintaining high-quality standards in display manufacturing.
• Automated Processes: The semi-automatic configuration reduces the need for manual intervention, increasing efficiency and consistency. This makes the bonding line suitable for high-volume production environments.
• Versatility: The line is designed to handle a variety of bonding processes, making it a versatile solution for different manufacturing needs. Whether you are producing displays for consumer electronics, automotive applications, or industrial control systems, this bonding line can meet your requirements.
• Customization: Shenzhen Olian offers tailored solutions to fit specific manufacturing processes and requirements. This ensures that the bonding line meets the unique needs of each customer, providing a customized and efficient solution.

7-17 Inch Semi-Automatic COG+FOG Bonding Line Applications

The 7-17 inch semi-automatic bonding line is widely used in the manufacturing of displays for various applications, including:

• Intelligent Wearable Devices: Smartwatches and other wearable technology.
• Mobile Phones: High-precision bonding for smartphone displays.
• Laptops and Tablets: Ensuring reliable connections in portable computing devices.
• Car Displays: Critical for automotive electronics and infotainment systems.
• HMI (Human Machine Interface): Essential for industrial control and automation.
• TVs and AD Displays: High-quality bonding for large-screen applications.

Why Choose Shenzhen Olian?

Shenzhen Olian is a leading provider of bonding machines and solutions, known for its commitment to quality, innovation, and customer satisfaction. The company’s 7-17 inch semi-automatic bonding line is a testament to its expertise in the field, offering a comprehensive solution for high-precision bonding needs.

By choosing Shenzhen Olian, you benefit from:

• Advanced Technology: State-of-the-art bonding machines designed for precision and reliability.
• Comprehensive Support: A wide range of processes and technologies to meet diverse manufacturing requirements.
• Proven Track Record: Long-term partnerships with leading companies in the industry, including HUAWEI, BYD, APPLE, FOXCONN, and more.

Whether you are manufacturing displays for consumer electronics, automotive applications, or industrial control systems, Shenzhen Olian’s 7-17 inch semi-automatic bonding line is the ideal choice for achieving high-quality, efficient, and reliable bonding processes.