ACF Bonding machine-Olian-About us

About us-Olian-ACF Bonding Machine 

Shenzhen Olian Automatic Equipment Co., Ltd (Olian) is a high-tech manufacturer established in 2008, professional specialized in R&D, manufacturing and sales of LCD/LED/OLED module automatic ACF bonding machine and other equipments.

Olian insist on the product concept of ” High quality, High efficiency”, have successfully developed standard and custom products:

Olian Design&Make the best and latest COG/FOG/FOB/FOF/FPC/OLB/TAB/COF/ACF Bonding Machine for TV/Cell phone/Laptop/Pad/Watch/Touch Screens.

Olian Main products: TV/Laptop/PAD/Cell phone/Watch/Touch screen/Display repairing machine, LCD/LED/OLED bonding machine, LCM produce machine, LCD/LED/OLED repair machine, and all the bonding machines, parts, tool, accessories .

1.LCD module produce machines:

Large, medium and small size COG machine, Semi-automatic COG machine, Automatic COG machine,ACF bonding machine, ACF attach machine, IC bonding machine, COG pre-bonding machine, COG main-bonding machine, FOB bonding machine, FOG bonding machine, FPC bonding machine, SMT machine, Tear film machine, detection device, PLASMA, LCD clearing machine,and all the mobile phone LCD/LED/OLED bonding machine;

Auxiliary equipment: IC disassembling machine, ACF split machine, Molybdenum wire machine, Heating platform, Manual or pneumatic test stand, etc;

2.Capacitive screen Touch screen device:

G + F laminating machine, G + G vacuum laminating machine, Touch screen ACF attach machine, Touch screen FOG, Hot press machine, PETOCA laminating machine, F + F, Automatic laminating machine, TP protective film laminating machine

3.Large size LCD Equipment:

TV repair machines:12-100inch COF bonding machine, LCD laser repair machine, LCD polarizer film repair machine,12-100 inch ACF attaching machine, COF bonding machine, PCB bonding machine, COF Pre-bonding machine, OLB Bonding machine and all the TV and laptop LCD bonding machine,LED bonding machine,OLED bonding machines;

4.Cell phone LCD/OLED repair machines:

LCD separate machine, LCD film machine, LCD laminating machine, LCD bubble remove machine, and other tools.

5.Accessories ,Parts and maintenance of the LCD module and TP equipment:

ACF tape, ACF remover, Silicone, Teflon, Quartz, Test platform , all kinds of bonding press head( SU440C bonding head, Tungsten steel bonding head, Titanium alloy press head) production and maintenance, grinding or design.We offer all the parts,accessories,for TV,Laptop,Pad,Cell phone Watch,LCD/LED/OLED IC/FPC/COF Bonding machines.

Olian welcome customers to visit our company for technical exchange and business negotiation. Olian will do the best to provide you with high quality equipment and satisfactory service. Olian determined to become the leading brands of the smart automatic equipment bonding machine industry.

Olian Welcome agents and resellers from around the world,

Welcome OEM&ODM for you.

Bonding Machine

Bonding Machine, is the widely used machine in the LCD/LED/OLED, LCM/open cell/panel/screen/display produce factories and repairing service shops all over the world.

The Bonding Machine is based on the recent innovations as well as planned to repair the arrangements of LCD, LED,OLED, TV/television, Laptop, Pad, Cell phone, Watch, Touch Panel, Ad Player, and all the flat and edge screens.

The Bonding Machine may consist of HD Digital Microscope, and also has a Digital Pressure Gauge, and vacuum generator which may help to hold the panel during the bonding process. The bonding press head may press the IC/FPC/COF onto the Glass/PCB/FPC using ACF conductive adhesive as medium, by a certain temperature, pressure and time. also some bonding machine use the Solder paste as the medium.

The Bonding Machine use the ACF tape as the medium ,so it also named ACF bonding machine.

ACF bonding machine

According to different LCD/LED/OLED and different screens, there are many ACF tapes models.  ACF tape is the important medium of the bonding process.

What is ACF?

ACF Tape/ACF Film  & Applications

ACF Tape is normally made up of two main components, namely Adhesive & conductive particles.

Adhesives

The adhesive composition is dependent on the materials being assembled. This means an ACF designed for use in a flex-on-glass (FOG) assembly is usually not suitable for use in a chip-on-glass (COG),chip-on-film(COF), flex-on-board(FOB),flex-on-flex(FOF) or any other configurations. It is specific to the application for which it is designed for.

ACF Conductive Particles

Conductive particles are used to conduct electricity from one side of the bond to the other. Depending on the application, conductive particles range from 3.5μm to 30μm in size, and can be made from Nickel-gold plated polymer spheres, gold plated nickel particles, or lead-free solder materials. Particles may be individually coated with a outer polymer to insulate them from other uncrushed particles, but which will crack open and allow electrical conduction if the particle is trapped and crushed between two pads during assembly.

ACF tape or ACF (Anisotropic Conductive Film)

ACF (Anisotropic conductive film) or ACF tape is an epoxy adhesive system used by electronics industry to make electrical and mechanical connections from drive electronics to substrates.

ACF are filled with conductive particles which provides electrical interconnection between pads through the film thickness (z-direction).

The conductive particles are distributed far apart thus not electrically conductive in the plane direction (X&Y) of the film.

ACF interconnect offers cost savings by substituting conventional mechanical connectors or soldering interconnect.

ACF interconnect allows low height and fine pitch which enables high density and miniaturizing of assembly.

ACF special conductive particle is made from environmental friendly material (ROHs compliance). It provides good metalic bonding.

What is ACF Bonding?

During ACF bonding, a combination of heat & pressure is applied on to chip (FPC/IC) for an appropriate time.

Conductive particles (each 3~30um) are compressed between IC and substrate (glass / PCB) while insulating materials pushed away.

This allows the compressed Ni-Au layer on the particles to conduct electricity between the IC and the substrates (z-axis).

The insulated particles are distributed with a minimum chance of electrical shorting in the x-axis and y-axis.

As the epoxy cures and conductive particles are trapped into permanent compressed form.

The compressed particles, by its elastic nature, are constantly pushing outwards to maintain good electrical conductivity under different environmental conditions.

ACF Bonding Machine Applications

ACF has for many years, been used in glass display applications. Recently, it is also becoming widely used in TAB,COG,FOG,FOB,FOF,COF,COB areas.

– TAB Bonding (TCP-PCB / TCP-LCD)

– COG Bonding (IC-LCD)

– COB Bonding (IC-PCB)

– COF Bonding (COF-LCD/PCB)

– FOG Bonding(FPC-LCD)

– FOB Bonding(FPC-PCB)

– FOF Bonding(FPC-FPC)

– Plasma Display (FPC-PDP)

– Flip Chip Package

– ……

ACF Bonding Machine Features

• Heat cure
• Fast bonding time
• High adhesion to plastic PET,COF & FPC, substrate
• Excellent thermal stability
• Good contact resistance for reliability
• Good corrosion resistance
• Excellent chemical resistance
• Good for wide bonding temperature range
• Replaces solder for lead-free solution

Because of ACF bonding machine‘s advantages and features ,the ACF bonding machine is becoming more and more popular and useful.

According to the different bonding materials, the bonding machine can be divided into different bonding machines.

COG bonding machine

COG bonding machine, also name IC Bonding machine, Chips bonding machine, COG(Chip on glass) bonding machine, it is bonding the Chip IC on the glass using ACF conductive adhesive as medium, by a certain temperature, pressure, time, driver IC will be bonded onto the glass. COG bonding machine has COG Pre-Bonding Machine and COG Main-Bonding Machine. They are all constant temperature machines. it maybe have single station ,double stations, three stations, and maybe four stations bonding machine.

FOG bonding machine

FOG bonding machine, also name FOB bonding machine, FPC bonding machine, Flex cable bonding machine.FOG(FPC on glass )or FOB(FPC on PCB Board), FOF(FPC on FPC), also COF on Glass bonding, COF on board bonding, COF on film bonding. It have Pulse Heating Bonding Machines and Constant Temperature Bonding Machines.

ACF attaching machine

ACF attaching machine which is attaching the ACF tape on the Glass/Board/FPC/COF before bonding. it also name ACF machine, ACF attachment machine, ACF Attached machine , ACF bonding machine , ACF pre-paste , ACF equipment , ACF pre-paste machines , ACF pre- affixed equipment, ACF single station machine , ACF multi-station machines and so on.  The attaching machine, also can paste the Double-sided tape.

LCM Making machines

Semi Automatic LCM Making machines include:COG pre-bonding machine, COG main-bonding machine , FOG（FOB) bonding machine, ACF attaching machine as below:

LCD bonding machine

Full automatic COG bonding machine

Full automatic COG bonding machine, it include the LCD cleaning, IC loading, ACF attaching on the glass, IC pre-bonding, and IC main-bonding processes.

Full automatic FOG bonding machine

Full automatic FOG bonding machine, It include the ACF attaching on the glass, FPC loading, FPC bonding on the glass and output to testing..

LCM full automatic produce machine

LCM full automatic produce machine include all the process of the COG and FOG bonding machines.

We design and make the standard bonding machines and customized bonding machines for your personalized product requirements, also design and manufacture other automation equipment for your requirements, and welcome OEM&ODM machines.

COF bonding machine/TAB bonding machine/ACF bonding machine

COF bonding machine, also name TAB bonding machine, ACF bonding machine, OLB Bonding machine, Chip on Film bonding machine. COF(Chip on Film, Chip on Flex).COF bonding machine is widely used in the TV/laptop/pad panel, it is very popular in the TV/laptop repairing for the LCD/LED/OLED panel bonding. For TV or laptop panel repairing COF bonding machine, has COF on glass bonding and COF on PCB board bonding. The COF Bonding machine also can do COF on flex cable, COF on film bonding, and maybe IC on film bonding. Normal the COF bonding machine is Pulse heating bonding machine with Titanium alloy press bonding head.

COF bonding machine accessories

Our COF bonding machine and all the accessories list for TV/laptop panel repairing as below:

COF bonding machine

We also offer the COF bonding machine(ACF Bonding machine/Tab Bonding machine )and all the accessories: ACF tapes, ACF Remover, Blue glue, Acetone, Alcohol ,Customized bonding head, Quartz glass, Silicone tape, Teflon tape, Microscope, Air Compressor, COF cutter, Cleaning nanosponge, Cleaning clothes wiper, Ear buds, Pump bottles, T-bit, T-rubber, T-Iron, Magnifier lens, Allen key, Precision tweezers, Soldering Stations, Removing Wind Station Hot Air Gun, LEDS,LVDS cables, LCD Test Board, LCD/LED Tester.RT809H programmer, Open cell, Polarizer, Backlight ,T-Con Board, Main-board, IC, TAB COF IC and others.

Welcome you visit us!