1-1. 1-7 Inch Display 3.5S Binding LineOverall Introduction
Overview:
The 1-7 Inch Display 3.5S Binding Line includes equipment such as Panel loading machine, terminal cleaning machine, single-sided single-chip IC (COG & COF), single-sided single FPC (FOG & FOF), particle AOI, three-in-one dispensing machine, TP terminal cleaning machine, TFOG binding, TFOF binding machine, fluorinated liquid coating machine, and back adhesive film attaching machine.
Process Flow & Equipment: 1-7 Inch Display 3.5S Binding Line is designed for small-size single-sided single-chip IC (COG & COF), single-sided single FPC (FOG & FOF), particle AOI, three-in-one dispensing machine, terminal cleaning machine, TFOG binding, TFOF binding machine, fluorinated liquid coating machine, and back adhesive film attaching machine.
CCD: With panoramic CCD photography loading function, can be opened or shielded
Power Supply / Power: 220V (±10%) / 50HZ / 2KW
Main Air Source / Air Consumption: 0.5~0.7Mpa / 150L/min
Equipment Dimensions: 1200(L)*1150(W)*1900(H)
Equipment Weight: ≈350Kg
Work Flow: Manual loading of full material suction tray to loading area → Robotic arm picks up product to downstream receiving position → Robotic arm picks up empty suction tray and places it in the unloading area for manual removal.
Overview: This is a fully automatic non-stop glass loader.
Overview: 1-7 Inch Display 3.5S Binding Line is a fully automatic single-sided Plasma terminal cleaning machine, achieving the full process from LCD visual correction, ITO terminal wiping, and ITO terminal Plasma cleaning. It is installed before the fully automatic COG (& COF) bonding machine.
Overview: This equipment is a small-size fully automatic COG (chip on glass) and compatible COF bonding machine, achieving the full process from ACF attachment, IC pre-press, and IC main press. The LCD uses visual correction, and the robotic arm uses a linear motor transportation design. The equipment automatically transports the LCD, with left and right platform infeeding and outfeeding, and single-sided single-chip IC bonding process.
Overview: This is a fully automatic COF punching machine, using a servo motor + cam drive, motor + tape tension mechanism to achieve automatic feeding. It uses CCD visual positioning and high-precision punching dies to achieve high-precision punching of rolls and single pieces. It can be used in conjunction with the company’s bonding equipment.
2-4. Bonding Section – FOG (FOF) Bonding Machine Specification
Project
Glass Size Range: 1″ to 7″ (16:9)
Glass Thickness Range: Min 0.2mm, Max 1.1mm
FPC Size: Min. 5.0×0.8, Max. 35×4, LMAX. 100mm
FPC Bonding Quantity: Single-sided single
Attachment Precision: X ± 0.15mm, Y ± 0.1mm
Total Bonding Precision: ±15μm
Process Cycle: 3.5S
Image Processing System: Beijing Boshi
Bonding Head Quantity: Attachment 1 + Pre-press 1 + Main press 4 sets
Overview: This equipment is a small-size fully automatic FOG, achieving the full process from ACF attachment, FPC pre-press, and FPC main press. The LCD uses visual correction, and the robotic arm uses a linear motor transportation design. The equipment automatically transports the LCD, with left and right platform infeeding and outfeeding (or conveyor line), and single-sided single FPC bonding process.
2-5. Bonding Section – FPC Loader Specification
Project
FPC Size: Max: 100175mm, Min: 1510mm
Process Cycle: 3.5S
Tray Size (Incoming Material Tray): 400x460mm (MAX), 250x220mm (MIN)
Main Air Source / Air Consumption: 0.5~0.7Mpa / 150L/min
Power Supply / Power: 220V (±10%) / 50HZ / 2KW
Equipment Weight: ≈400Kg
Equipment Dimensions: 1100(L)*1100(W)*1760(H)
Overview: This is a fully automatic FPC loader with panoramic + outfeeding alignment, generally used after FOG to supply materials for FOG/TFOG.
FPC Size: Bonding area length <64mm; Non-bonding side <120mm; Detection area width <1.8mm; If exceeding 1.8mm, line scan multiple times
Scratch Detection:
Detection Objects: IC, FPC particle scratches
IC, FPC Offset: Calculated by capturing the distribution of conductive particles
Offset Detection Precision: ±1.5um
IC, FPC Distribution Uniformity: By segmenting the ROI and detecting the number of particles in each segment to determine uniform distribution (up to ten segments)
Overview: This is a fully automatic single-sided Plasma terminal cleaning machine, achieving the full process from LCD visual correction, ITO terminal wiping, and ITO terminal Plasma cleaning. It is installed before the fully automatic TFOG bonding machine.
Overview: This equipment is a small-size fully automatic TFOG, achieving the full process from ACF attachment, FPC pre-press, and FPC main press. The LCD uses visual correction, and the robotic arm uses a linear motor transportation design. The equipment automatically transports the LCD, with left and right platform infeeding and outfeeding (or conveyor line), and single-sided single TFPC bonding process.
Overview: This equipment is suitable for Film Cover (Film Cover) integrator for Easy Stick and thermal conductive film pieces of abnormal sharp wearable products within 45mm*45mm size.
1-7 Inch Display 3.5S Binding Line includes equipment such as Panel loading machine, terminal cleaning machine, single-sided single-chip IC (COG & COF), single-sided single FPC (FOG & FOF), particle AOI, three-in-one dispensing machine, TP terminal cleaning machine, TFOG binding, TFOF binding machine, fluorinated liquid coating machine, and back adhesive film attaching machine. The line is designed for small-size single-sided single-chip IC (COG & COF), single-sided single FPC (FOG & FOF), particle AOI, three-in-one dispensing machine, terminal cleaning machine, TFOG binding, TFOF binding machine, fluorinated liquid coating machine, and back adhesive film attaching machine.
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